Patents Assigned to MEC Company Limited
  • Method for surface treatment of copper or copper alloys
    Patent number: 6106899
    Abstract: A method for bonding a resin which has a high glass transition temperature but low affinity to copper surfaces with a copper surface with sufficient adhesive strength. The method comprises coating the copper surfaces with an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative, or an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative and at least 0.1% of aminotriazole or an aminotriazole derivative.
    Type: Grant
    Filed: July 16, 1998
    Date of Patent: August 22, 2000
    Assignee: MEC Company Limited
    Inventors: Toshiko Nakagawa, Ryo Ogushi