Abstract: The present invention provides a device for single-sided electrolytic treatment of a flat substrate. The device comprises a bath for electrolytic fluid and conveying means for conveying the flat substrate in a conveying direction at the free surface of the fluid in the bath, with the flat substrate being horizontally oriented such that the underside of the flat substrate makes contact with the free surface of the fluid in the bath. The conveying means comprise two conveying elements disposed opposite each other, which extend along two respective conveying paths, which conveying paths each comprise an electrolytic part, which electrolytic parts extend on two opposite longitudinal sides of the bath.

Abstract: Solar cells are produced using a method for producing solar cells, wherein silicon containing vitreous substrates is provided, wherein each substrate is provided with an electrically conductive material on at least one side thereof. In the method, at least a portion of each substrate is successively transported through an electrolytic solution that is present in an electrolytic bath, and the electrically conductive material as the cathode is connected during the transport of the substrates through the electrolytic bath for the purpose of electrodepositing material from the electrolytic solution onto the electrically conductive material during said transport, wherein the substrates are suspended from a conveyor element during transport and extend in the transport direction.

Abstract: The present invention provides a device for single-sided electrolytic treatment of a flat substrate. The device comprises a bath for electrolytic fluid and conveying means for conveying the flat substrate in a conveying direction at the free surface of the fluid in the bath, with the flat substrate being horizontally oriented such that the underside of the flat substrate makes contact with the free surface of the fluid in the bath. The conveying means comprise two conveying elements disposed opposite each other, which extend along two respective conveying paths, which conveying paths each comprise an electrolytic part, which electrolytic parts extend on two opposite longitudinal sides of the bath.

Abstract: The present invention provides a method for producing solar cells, comprising the steps of—providing silicon containing vitreous substrates, each provided with an electrically conductive material on at least one side thereof, —successively transporting at least a portion of each substrate through an electrolytic solution that is present in an electrolytic bath, —connecting said electrically conductive material as the cathode during the transport of the substrates through the electrolytic bath for the purpose of electrodepositing material from the electrolytic solution onto the electrically conductive material during said transport, wherein the substrates are suspended from a conveyor element during transport and extend in the transport direction. The invention further provides a device for producing solar cells.

Abstract: A method and device for making an electrically conductive connection between two electrically conductive tracks present on two opposite sides of a dielectric substrate. The method: a) provides the substrate, with at least one first electrically conductive track present on one side thereof and at least one second electrically conductive track present on the other side of the substrate opposite the one side, b) forms a through hole through the substrate and through two opposite parts of a first track and a second track, respectively, and c) makes an electrically conductive connection via the through hole between the first track through which the through hole has been formed and the second hole through which the through hole has been formed.

Abstract: A device for treating a band-shaped substrate with a liquid, including: a conveying system including a winding system guiding the band-shaped substrate in a spiral path around the winding system with at least one winding; a first pulley rotatable about a first axis of rotation guiding the at least one winding of the band-shaped substrate through a first angle of deflection around part of the circumference of the first pulley, and a second pulley guiding the at least one winding of the band-shaped substrate through a second angle of deflection around part of the circumference of the second pulley, which is rotatable about a second axis of rotation, for each winding; and a bath of the liquid. The band-shaped substrate extends through the liquid over at least part of the length of the at least one winding. The second axis of rotation of each second pulley makes an angle alpha with the first axis of rotation.

Abstract: The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of immersing the substrate with the pattern present thereon in an electrolytic bath, electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate. The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.

Abstract: A method and device for making an electrically conductive connection between two electrically conductive tracks present on two opposite sides of a dielectric substrate. The method: a) provides the substrate, with at least one first electrically conductive track present on one side thereof and at least one second electrically conductive track present on the other side of the substrate opposite the one side, b) forms a through hole through the substrate and through two opposite parts of a first track and a second track, respectively, and c) makes an electrically conductive connection via the through hole between the first track through which the through hole has been formed and the second hole through which the through hole has been formed.

Abstract: The invention relates to a method and a device for separating products mounted on a common substrate, from each other, along (a) cutting line(s). The products each comprise one or more chips present on said substrate and connecting means connected thereto, the connecting ends remote from the chip of which are provided with solder balls bonded thereto. The products are clamped down on a supporting element by using a sub-atmospheric pressure, and the supporting element and a rotary cutting blade are moved relative to each other along the intended cutting line so as to cut through the substrate. A liquid is supplied at the location of said cutting line on either side of the substrate.

Abstract: The invention relates to a method and a device for bonding solder balls to connecting points which are provided on a substrate in a predetermined pattern. The solder balls are placed into holes provided in a plate-shaped element, which holes are each capable of accommodating one solder ball, and which are provided in the plate-shaped element in a pattern which corresponds with the pattern of the connecting points on the substrate. A combination of at least one substrate and a plate-shaped element containing solder balls is passed, by means of a conveying element, through a housing in which the solder balls are subjected to a heat treatment. The combinations, which each consist of at least one plate-shaped element and at least one substrate, are passed through the housing by the conveying element via lock mechanisms disposed near an inlet and near an outlet of the housing. Inside the housing the solder balls are placed into the holes provided in the plate-shaped element.

Abstract: The invention relates to a method and an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For masking purposes a fully closed photoresist layer is electrophoretically applied to the products, and after drying of the photoresist layer, the products are covered with a photomask in accordance with the locations to be plated, after which exposure takes place. Then the photoresist layer is partially removed, while the remaining part of the photoresist layer remains behind on the products, to serve as a mask for the metal products upon electroplating.

Abstract: The invention relates to an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For masking purposes a fully closed photoresist layer is electrophoretically applied to the products, and after drying of the photoresist layer, the products are covered with a photomask in accordance with the locations to be plated, after which exposure takes place. Then the photoresist layer is partially removed, while the remaining part of the photoresist layer remains behind on the products, to serve as a mask for the metal products upon electroplating.

Abstract: This invention relates to a method and apparatus for selective electroplating of metals on metal or metallized products in an elongated strip. Use is made of an apparatus in which an assembly of a masking belt and the product strip are guided along means for exposing the products to an electrolyte. Masking belt and product strip have been provided with holes distributed in a regular pattern over their respective lengths, while driving means are provided lengthwise transport masking belt and product strip. By means of proximity sensors, signals are obtained which indicate the position of the holes in the masking belt and product strip in positions which, related to the direction of travel of belt and strip are situated up stream and nearby the means for exposing the products to an electrolyte.

Abstract: Immersing semiconductor devices and similar electronic components in an aqueous solution of one or more organic solvents, conducting salts and a wetting agent and connecting the components to be cleaned to the negative pole of a source of direct current, of which the positive pole is connected to an anode in the same solution, and passing current through the solution raises the pH of the electrolyte film on the cathodic metal surface to a value whereby the organic solvent causes a softening of the plastic mold flash or bleed, sufficient to enable the hydrogen gas generated simultaneously on the cathode to remove the plastic mold flash or bleed from the metal surfaces.

Abstract: The invention relates to a device for applying dot-shaped coatings to metal or metallized bands by way of an electrolysis process or by way of currentless metal extraction, said device being provided with a wheel-shaped guide mechanism along which a metal or metallized band can be passed, and with an endless masking device, which co-operates with the band during operation and which is provided with passages, whose shape is adapted to the desired dot-shaped coating. The masking device is built up of independent masking segments, which are each provided with at least one passage and which are mutually coupled in such a manner that they can move with respect to each other in the longitudinal direction of the masking device.

Abstract: The invention relates to an apparatus provided with resilient clamping means for clamping strip-shaped elements onto the endless belt, in such a manner that the strip-shaped elements can be led through one or more treatment baths. The resilient clamping means are each connected at one end to the endless belt, and abut with their other free clamping end against the belt under the influence of their own resilience. Near one loading and/or unloading station the apparatus comprises means for pushing the free clamping ends of the clamping means in a direction away from the belt.

Abstract: Device for providing, by an electrolytic process, a stripe shaped coating on an elongated conductive strip, said strip being guided along a rotatable wheel and provided with means for moving the strip in its longitudinal direction, in such a way that over part of the path the strip travels against at least part of the outer circumference of the wheel, whilst at the side of the strip remote from the wheel a stationary masking strip is provided, which covers at least part of the part of the strip which is in contact with the wheel and which is provided with holes, so that via the holes an electrolyte can be brought into contact with the part of the strip which moves along the holes during operation. A groove, extending in the longitudinal direction of the masking strip is provided in the side of the masking strip directed towards the strip, the width of said groove being equal to the width of the coating to be provided on the strip, whilst the holes debouch into said groove.

Abstract: Method for electroplating a metallic deposit on interconnected or bandoliered elongate metallic and/or metallized products, whereby providing for non-conductive masking devices between the products, of which at least the parts which are in contact with the products consist of resilient material while, after providing for the said masking devices, the products are submitted to a contact with an electrolyte.

Abstract: A galvano-technical device for locally applying a metal layer to an elongate metal tape or to metal objects united in an elongate tape or the like in which the tape is guided along a roller adapted to rotate about a rotary axis in operation and being dipped at least partly in an electrolyte solution and in which the tape is displaced parallel to the rotary axis of the roller in a manner such that the parts of the tape to be provided with the metal layer come into contact with the roller whereby the device comprises a guide surface being stationary during operation in the direction of displacement of the tape, along which surface the tape is displaced during operation, and a guide rim extending parallel to the rotary axis of the roller and protruding out of the guide surface for the edge of the elongated tape remote from the roller, against which rim the edge of the elongate tape is pressed with the aid of wheels pressing the tape against the guide surface and having their rotary axes at an acute angle to the

Abstract: A device for galvanically applying a coating of metal, particularly precious metal to separate objects whereby that the device comprises a wheel-shaped member adapted to rotate about a rotary axis and coupled with a driving source, at least one holder fastened to the wheel-shaped member and provided with means for supporting the objects, at least one reservoir arranged below the wheel-shaped member and having at least one opening on its top side and being in sealing relationship at least around said opening with the underside of the wheel-shaped member and means for supplying pressurized electrolyte to the reservoir, while the wheel and the holder(s) have passages for guiding electrolyte from the reservoir to the objects supported by the holder(s).