Patents Assigned to MED USA
  • Patent number: 11373925
    Abstract: A silver-indium transient liquid phase method of bonding a semiconductor device and a heat-spreading mount, and a semiconductor structure having a silver-indium transient liquid phase bonding joint are provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: June 28, 2022
    Assignee: LIGHT-MED (USA), INC.
    Inventors: Yongjun Huo, Chin Chung Lee
  • Publication number: 20220084903
    Abstract: A semiconductor structure having a silver-indium transient liquid phase bonding joint is provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.
    Type: Application
    Filed: November 24, 2021
    Publication date: March 17, 2022
    Applicant: LIGHT-MED (USA), INC.
    Inventors: Yongjun HUO, Chin Chung LEE
  • Publication number: 20220005744
    Abstract: A silver-indium transient liquid phase method of bonding a semiconductor device and a heat-spreading mount, and a semiconductor structure having a silver-indium transient liquid phase bonding joint are provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.
    Type: Application
    Filed: May 7, 2019
    Publication date: January 6, 2022
    Applicant: LIGHT-MED (USA), INC.
    Inventors: Yongjun HUO, Chin Chung LEE
  • Patent number: 7001371
    Abstract: An implantable infection shield and system for drug delivery in vascular tissue includes a relatively non-biodegradable porous linked fibrous biomaterial which controls and directs cell growth and angiogenesis from adjacent vascular tissue into the implant. Infection shield embodiments stimulate cell growth and angiogenesis from adjacent vascular tissue which effectively blocks passage of pathogenic microorganisms along percutaneously implanted objects. In embodiments for drug delivery, a reservoir of the same biomaterial may contain either (1) a cell culture system enclosed within a porous sealable interior chamber or (2) a biodegradable matrix in which one or more drugs are dispersed. After implantation of a reservoir of the first embodiment in an organism, cultured cells obtain food and oxygen via diffusion in tissue fluid through the porous walls of the interior chamber, while metabolic products, including drugs, diffuse away from the cell culture in an analogous manner.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: February 21, 2006
    Assignee: MED USA
    Inventors: Charles A. McLaughlin, Mark B. Lyles, Glenn A. Halff, William A. Mallow
  • Patent number: 6340360
    Abstract: An implantable infection shield and system for drug delivery in vascular tissue includes a relatively non-biodegradable porous linked fibrous biomaterial which controls and directs cell growth and angiogenesis from adjacent vascular tissue into the implant. Infection shield embodiments stimulate cell growth and angiogenesis from adjacent vascular tissue which effectively blocks passage of pathogenic microorganisms along percutaneously implanted objects. In embodiments for drug delivery, a reservoir of the same biomaterial may contain either (1) a cell culture system enclosed within a porous sealable interior chamber or (2) a biodegradable matrix in which one or more drugs are dispersed. After implantation of a reservoir of the first embodiment in an organism, cultured cells obtain food and oxygen via diffusion in tissue fluid through the porous walls of the interior chamber, while metabolic products, including drugs, diffuse away from the cell culture in an analogous manner.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: January 22, 2002
    Assignee: MED USA
    Inventors: Mark B. Lyles, Charles A. McLaughlin, Glenn A. Halff, William A. Mallow
  • Patent number: 5964745
    Abstract: An implantable infection shield and system for drug delivery in vascular tissue includes a relatively non-biodegradable porous linked fibrous biomaterial which controls and directs cell growth and angiogenesis from adjacent vascular tissue into the implant. Infection shield embodiments stimulate cell growth and angiogenesis from adjacent vascular tissue which effectively blocks passage of pathogenic microorganisms along percutaneously implanted objects. In embodiments for drug delivery, a reservoir of the same biomaterial may contain either (1) a cell culture system enclosed within a porous sealable interior chamber or (2) a biodegradable matrix in which one or more drugs are dispersed. After implantation of a reservoir of the first embodiment in an organism, cultured cells obtain food and oxygen via diffusion in tissue fluid through the porous walls of the interior chamber, while metabolic products, including drugs, diffuse away from the cell culture in an analogous manner.
    Type: Grant
    Filed: March 18, 1996
    Date of Patent: October 12, 1999
    Assignee: Med USA
    Inventors: Mark B. Lyles, Charles A. McLaughlin, Glenn A. Halff, William A. Mallow