Abstract: An image sensing module manufacturing method includes steps: forming a mold and then disposing a plurality of lenses into a barrel of the mold; after confirming the position of the plurality of lenses, adhesively combining the plurality of lenses; installing an image sensor inside the barrel; fixing the image sensor after confirming the position relationship between the plurality of lenses and the image sensor; and cutting the mold to obtain a plurality of image sensing modules.

Abstract: An endoscope includes a catheter having a lens at one end and extending into a handle, an instrument tube partly received in the handle and partly exposed outside, a linkage unit within the handle, a controlling unit pivotally connected to the linkage unit, a cable connecting the linkage unit and the catheter periphery, a tension unit connected to the cable, and a tension adjusting unit having adjusting members and connection members coupled to the tension unit, thereby enhancing lens control sensitivity and improving instrument insertion and withdrawal smoothness to elevate medical quality.

Abstract: A fundus camera includes an objective lens, an illumination device, an imaging lens group and an image sensor. The illumination device has a light emitting position and includes a plurality of light emitting modules and a driving element. Each light emitting module generates a corresponding illumination light, and the optical characteristics of the illumination lights are different from each other. The driving element drives one of the light emitting modules to the light emitting position of the illumination device to output an illumination light with required optical characteristics and irradiate it to a fundus through the objective lens. The imaging light reflected by the fundus passes through the objective lens and the imaging lens group to form an image on the image sensor so as to generate a fundus image. The abovementioned fundus camera has a compact structure and can switch the illumination light sources in a short time to obtain fundus images with different optical characteristics.

Abstract: The invention provides a light-emitting image sensing module and a method for fabricating the same. The light-emitting image sensing module includes a circuit board, an image sensor, conductive carriers, light sources, an opaque lens barrel, and a lens module. The image sensor and the conductive carriers are arranged on the circuit board. The light sources are arranged on the conductive carrier. The opaque lens barrel is penetrated by a first hole and a second hole and arranged on the circuit board. The first hole sleeves the image sensor, and the second hole sleeves the conductive carriers and the light sources. The lens module is fixed in the first hole and arranged above the image sensor. The invention uses the circuit board to carry out the packaging process of the image sensor and the light source, so as to achieve the economic benefit.

Abstract: An endoscopic light source-imaging module including a substrate, an image sensor, and a light-emitting element is provided. The top surface of the substrate is provided with a cavity. The cavity has a first surface and a second surface neighboring each other and having a preset height drop therebetween. A first conductive route and a second conductive route of the substrate extend from the top surface penetrating through the substrate to a bottom surface. The image sensor is disposed on the first surface and is electrically connected to the first conductive route. The light-emitting element is disposed on the second surface, neighboring one side of the image sensor and electrically connected to the second conductive route. The present invention improves the image quality of the endoscope, reduces the module size, decreases the fabrication stages, increases the productivity, and lowers the cost.

Abstract: A method for manufacturing an image sensor package is provided, in which a plurality of trenches is provided in the package substrate and the trenches and a plurality of predetermined dicing lines define the desired contour of the package substrate to maximize the space utilization of the image sensor package in the distal end of the endoscope. In addition, the contour of the package substrate matches the shape of the distal end of the endoscope, thus facilitating the positioning and assembly of the image sensor package. An image sensor package manufactured by the abovementioned manufacturing method and an endoscope including the image sensor package are also disclosed.

Abstract: An image sensor package includes a substrate, an image sensor, and at least one light-emitting element. The substrate has a plurality of electric-conduction contacts. The image sensor is arranged on the substrate electrically connected with the substrate. The light-emitting element includes a spacer and a light-emitting diode. The spacer has a plurality of electric-conduction contacts. The light emitting diode is arranged on the spacer and electrically connected with the spacer. The spacer is arranged on the substrate and electrically connected with the substrate. The spacer has a predetermined thickness, so that the height of a light input surface of the image sensor is larger than or equal to the height of a light output surface of the light-emitting diode. The above-mentioned image sensor package favors optimization of illumination. An endoscope including the above-mentioned image sensor package is also disclosed.

Abstract: An image sensor package includes a substrate, an image sensor, a plurality of light-emitting elements, and a scattering layer. The substrate includes a plurality of first conductive contacts, a plurality of second conductive contacts, and a plurality of third conductive contacts, wherein the second conductive contacts and the third conductive contacts are electrically connected with the corresponding first conductive contacts. The image sensor is disposed on the substrate and electrically connected to the second conductive contacts. The light-emitting elements are disposed on the substrate and electrically connected with the third conductive contacts. The scattering layer covers at least one sidewall of the light-emitting elements. The abovementioned image sensor package can provide better illumination effects. An endoscope including the abovementioned image sensor package is also disclosed.

Abstract: An image sensor package includes a first substrate, an image sensor, a second substrate, a light-emitting element, and a first encapsulant. The image sensor is disposed on and electrically connected with the first substrate. The second substrate is disposed on and electrically connected with the first substrate, wherein the second substrate includes an accommodating portion and the image sensor protrudes from the second substrate via the accommodating portion. The light-emitting element is disposed on the second substrate and close to the image sensor, and is electrically connected to the second substrate. The first encapsulant is filled in a space between the image sensor and the light-emitting element. The abovementioned image sensor package can achieve miniaturization and provide better illumination. An endoscope including the abovementioned image sensor package is also disclosed.

Abstract: A packaged image sensor includes a substrate, an image sensor, a light-emitting element, and a first encapsulant. The substrate includes a through-hole. The image sensor and the light-emitting element are disposed on the substrate and are electrically connected to the substrate. The first encapsulant is filled between the image sensor and the light emitting element, and keeps the through-hole of the substrate opened. The through-hole of the substrate of the above-mentioned packaged image sensor can define a relative position between a pipe and the image sensor to facilitate the subsequent packaging process. An endoscope including the above-mentioned packaged image sensor is also disclosed.

Abstract: A packaged image sensor includes a first pipe and a second pipe, wherein the first pipe with a shorter length is initially encapsulated with an image sensor and a light-emitting element to define a relative position between the first pipe and the image sensor. The second pipe is connected to the first pipe and then is encapsulated in a second encapsulation process. The abovementioned packaged image sensor is easy to manufacture. An endoscope including the abovementioned packaged image sensor is also disclosed.

Abstract: A scanning device applied to an optical coherence tomography system integrates a scanning lens group required by the coherence tomography system into a fundus imaging system, so that the coherence tomography system and the fundus imaging system can share the scanning lens group for focusing. The above-mentioned scanning device can shorten a response time of focusing and reduce the volume of the system. An optical coherence tomography system including the above-mentioned scanning device is also disclosed.

Abstract: An image sensor package includes a substrate, an image sensor, a light-emitting element, and a package body. The substrate includes a plurality of first conductive contacts and a plurality of second conductive contacts. The image sensor is disposed on the substrate and electrically connected to the corresponding first conductive contacts. The light-emitting element is close to the image sensor, disposed on the substrate and electrically connected to the corresponding first conductive contacts. The package body is filled between the image sensor and the light emitting element. The above-mentioned image sensor package can achieve miniaturization, provide uniform illumination, and increase light utilization efficiency. An endoscope including the above-mentioned image sensor package is also disclosed.

Abstract: A fundus camera displays guide information on a display panel which can be viewed by a testee to guide the testee to adjust a relative position of the fundus camera and a tested eyeball of the testee to a determined position. Therefore, the testee can use the above-mentioned fundus camera to self-shoot fundus images with better image quality. A method for self-shooting fundus is also disclosed.

Abstract: A fundus camera includes an eyeball-offset detection device and an annular illumination device. The eyeball-offset detection device is configured to detect an offset vector of a lens of the fundus camera relative to an inspected eyeball. The annular illumination device includes a plurality of illumination elements that are arranged in a ring shape around an optical axis of an imaging system of the fundus camera. According to the offset vector of the lens relative to the inspected eyeball, the fundus camera selectively activates one or more illumination elements at corresponding positions to keep an illumination optical path away from a center area of the pupil of the inspected eyeball to reduce effects of corneal reflection and improve illumination quality. Therefore, the abovementioned fundus camera has a large operable range.

Abstract: A slit illumination device includes a first light-emitting element, a first diaphragm and a projection lens group. The first light-emitting element generates a primary illumination light. The first diaphragm has at least one opening and is disposed on a light exit side of the first light-emitting element, wherein the opening is an elongate shaped opening. The projection lens group is disposed on a light exit side of the first diaphragm, converging the primary illumination light and projecting it to a target object. A distance from the first diaphragm to the projection lens group is 1-2 times a focal length of the projection lens group on a light entrance side. The foregoing slit illumination device has advantages of simple structure, small size, and longer depth of field. A microscope system including the foregoing slit illumination device is also disclosed.