Abstract: Provided are surgical instrument including a base body, a shaft unit extending in a direction from the base body and having an end at which an end effector is mounted, a gear unit including a first gear mounted on the base body and a second gear mounted on another end of the shaft unit and engaged with the first gear, and a bearing unit positioned between the base body and the first gear.

Abstract: A wafer processing method is provided. The method includes preparing a wafer having a notch portion at one side thereof, aligning the wafer by analyzing image information of the notch portion captured by a vision camera, and processing the notch portion using a notch wheel so that a certain region of the notch portion has a preset thickness.

Abstract: Provided is an arm assembly for a surgical robot. The arm assembly for the surgical robot having a plurality of robot arms, includes a first pulley attached to one side of each robot arm, a second pulley attached to the other side of the robot arm to be spaced apart from the first pulley, and a first strap of which one end is connected to the first pulley and the other end is connected to the second pulley, wherein a position of one end of the first strap is fixed to the first pulley and a position of the other end of the first strap is adjustable on the second pulley.

Abstract: A surgical robot system includes a slave robot, a master console, a first display and a control portion. The slave robot includes a plurality of robot arms at which surgical tools are mounted. The master console performs remote control on the slave robot in response to a manipulation of an operator. The first display is arranged around the slave robot. The control portion outputs image information displaying information about a position of the event on an image corresponding to a shape of the slave robot or the master console to the first display when the event occurs in the slave robot or the master console.

Abstract: [PROBLEMS] To provide a method and an apparatus for cutting a conductive link of a redundant circuit in a semiconductor circuit. [MEANS FOR SOLVING PROBLEMS] A method is provided for selectively cutting a plurality of conductive links embedded in a protection layer which covers at least the conductive links in a semiconductor device formed on a semiconductor substrate. A focused beam is aligned with a target link, a first pulsed laser beam having a short laser wavelength of 400 nm or shorter and a second pulsed laser beam having a wavelength longer than 400 nm are generated, the first and the second pulsed laser beams are overlapped and applied onto the conductive link from over the protection layer. Preferably, the second pulsed laser is applied after the first pulsed layer in terms of time.