Abstract: The present disclosure relates to an epoxy resin composition having a thermal conductivity of at least 5 W/m·k, which has a sufficient thermal emission effect when implementing a multilayer circuit and can replace a ceramic substrate used in automobiles, home appliances, electric vehicles and the like, and to a heat dissipation circuit board using the same. The epoxy resin composition according to one embodiment of the present disclosure, the epoxy resin composition includes an epoxy resin, a curing agent and an inorganic filler. The inorganic filler may include alumina having a maximum particle diameter of less than 32 ?m and aluminum nitride having a mean particle diameter of 0.5 to 1.0 ?m, in an amount of 85 wt % or more. The epoxy resin composition includes an inorganic filler having a mean particle diameter of 1.