Patents Assigned to Meikle Automation Inc.
  • Solder shaping process and apparatus
    Patent number: 6793125
    Abstract: A process and apparatus for forming fusible solder material mounted on a substrate with the use of a tool having a treatment surface with selected shape. The solder material is heated sufficiently to cause fusing after which the tool is moved such that the treatment surface enters the fused material. The material is allowed to cool to permit re-solidification, after which the treatment surface is withdrawn from the solder, leaving the imprinted shape. The treatment surface is made of material that is not wettable by the solder.
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: September 21, 2004
    Assignee: Meikle Automation Inc.
    Inventors: Paul Foley, Nick Wagner