Patents Assigned to Mektec Corporation
  • Patent number: 6808866
    Abstract: A process for massively producing tape type flexible printed circuits is provided. The steps of pressing, etching and insulating are executed on a flexible insulation tape in reel-to-reel fashion. Thereafter, the flexible insulation tape is punched to form sprocket holes and cut along the parallel lines where the sprocket holes arrange on to become several winds of narrower flexible circuit tapes. Each flexible circuit tape has tape type flexible printed circuits and sprocket holes at two sides.
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: October 26, 2004
    Assignee: Mektec Corporation
    Inventors: Jung-Chou Huang, Wen-Yann Su, Kuei-Hao Pang, Grow-Hao Lo, Che-Hui Chu
  • Publication number: 20040139600
    Abstract: A process for massively producing tape type flexible printed circuits is provided. The steps of pressing, etching and insulating are executed on a flexible insulation tape in reel-to-reel fashion. Thereafter, the flexible insulation tape is punched to form sprocket holes and cut along the parallel lines where the sprocket holes arrange on to become several winds of narrower flexible circuit tapes. Each flexible circuit tape has tape type flexible printed circuits and sprocket holes at two sides.
    Type: Application
    Filed: January 12, 2004
    Publication date: July 22, 2004
    Applicant: MEKTEC CORPORATION
    Inventors: Jung-Chou Huang, Wen-Yann Su, Kuei-Hao Pang, Grow-Hao Lo, Che-Hui Chu
  • Publication number: 20030207211
    Abstract: A process for massively producing tape type flexible printed circuits is provided. The steps of pressing, etching and insulating are executed on a flexible insulation tape in reel-to-reel fashion. Thereafter, the flexible insulation tape is punched to form sprocket holes and cut along the parallel lines where the sprocket holes arrange on to become several winds of narrower flexible circuit tapes. Each flexible circuit tape has tape type flexible printed circuits and sprocket holes at two sides.
    Type: Application
    Filed: May 1, 2002
    Publication date: November 6, 2003
    Applicant: MEKTEC CORPORATION
    Inventors: Jung-Chou Huang, Wen-Yann Su, Kuei-Hao Pang, Grow-Hao Lo, Che-Hui Chu