Patents Assigned to Mektec Corporation
  • Method for manufacturing printed circuit board with electronic component, and printed circuit board with electronic component
    Patent number: 12250777
    Abstract: Provided is a method for manufacturing a printed circuit board with electronic component, including: mounting an electronic component on an insulating substrate; applying an insulating first coating resin to at least a part of the electronic component; curing the first coating resin; applying an insulating second coating resin to the cured first coating resin; and curing the second coating resin.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: March 11, 2025
    Assignee: MEKTEC CORPORATION
    Inventors: Jiang Zhu, Shota Obuchi
  • Heater including flexible printed wiring board and method for manufacturing same
    Patent number: 12193146
    Abstract: A heater includes: a flexible printed wiring board including a base film and a metal foil provided on one side of the base film; a heater circuit portion that is formed from the metal foil and generates heat when energized; and a heat conductive foil portion that is formed from the metal foil at a position away from the heater circuit portion and is maintained in a non-energized state.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: January 7, 2025
    Assignee: MEKTEC CORPORATION
    Inventors: Shunsuke Aoyama, Kenji Kiya
  • Process for massively producing tape type flexible printed circuits
    Patent number: 6808866
    Abstract: A process for massively producing tape type flexible printed circuits is provided. The steps of pressing, etching and insulating are executed on a flexible insulation tape in reel-to-reel fashion. Thereafter, the flexible insulation tape is punched to form sprocket holes and cut along the parallel lines where the sprocket holes arrange on to become several winds of narrower flexible circuit tapes. Each flexible circuit tape has tape type flexible printed circuits and sprocket holes at two sides.
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: October 26, 2004
    Assignee: Mektec Corporation
    Inventors: Jung-Chou Huang, Wen-Yann Su, Kuei-Hao Pang, Grow-Hao Lo, Che-Hui Chu
  • Process for massively producing tape type flexible printed circuits
    Publication number: 20040139600
    Abstract: A process for massively producing tape type flexible printed circuits is provided. The steps of pressing, etching and insulating are executed on a flexible insulation tape in reel-to-reel fashion. Thereafter, the flexible insulation tape is punched to form sprocket holes and cut along the parallel lines where the sprocket holes arrange on to become several winds of narrower flexible circuit tapes. Each flexible circuit tape has tape type flexible printed circuits and sprocket holes at two sides.
    Type: Application
    Filed: January 12, 2004
    Publication date: July 22, 2004
    Applicant: MEKTEC CORPORATION
    Inventors: Jung-Chou Huang, Wen-Yann Su, Kuei-Hao Pang, Grow-Hao Lo, Che-Hui Chu
  • Process for massively producing tape type flexible printed circuits
    Publication number: 20030207211
    Abstract: A process for massively producing tape type flexible printed circuits is provided. The steps of pressing, etching and insulating are executed on a flexible insulation tape in reel-to-reel fashion. Thereafter, the flexible insulation tape is punched to form sprocket holes and cut along the parallel lines where the sprocket holes arrange on to become several winds of narrower flexible circuit tapes. Each flexible circuit tape has tape type flexible printed circuits and sprocket holes at two sides.
    Type: Application
    Filed: May 1, 2002
    Publication date: November 6, 2003
    Applicant: MEKTEC CORPORATION
    Inventors: Jung-Chou Huang, Wen-Yann Su, Kuei-Hao Pang, Grow-Hao Lo, Che-Hui Chu