Abstract: The invention relates to a multi-layer planar inductance coil on a portion of a first plate-shaped support (10) which has a plurality of first conducting layers (14) which extend substantially parallel to each other and which is designed for holding and contacting further electronic components (32), wherein at least one conducting layer (14) of the first support, which forms a first electrical winding, is arranged for co-operation with a core (24) which is provided for guiding a magnetic flux and which is to be arranged in the portion, wherein at least one second plate-shaped support (20; 22; 44; 54) with a plurality of second conducting layers (16; 18) which extend substantially parallel to each other is so arranged in the portion parallel to the first support (10) that at least one conducting layer (16) of the second support, which provides a second electrical winding, can inductively co-operate with the core (24) and the first electrical winding.

Abstract: The invention relates to a device for cooling a planar inductance coil, in particular a planar transformer, on a plate-shaped support having a plurality of conducting layers, wherein at least one conducting layer of the support, in co-operation with a core element designed to guide a magnetic flux, provides the planar inductance coil, wherein on its first side towards a surface of the support the core element is connected to said side by means of a heat-conducting adhesive and on a second planar outside surface it is preferably substantially over the entire surface glued to a cooling element having a planar contact surface.