Patents Assigned to Melt Solutions, L.L.C.
  • Taphole fill material and method for manufacturing the same
    Patent number: 8216954
    Abstract: A high-temperature, heat-resistant fill material is disclosed. The high-temperature, heat-resistant fill material includes an alumina refractory waste material having one or more of a used alumina-magnesium-carbon material, a used high-alumina material and a used fused-grain alumina material is disclosed. A method for method for manufacturing a material is also disclosed.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: July 10, 2012
    Assignees: Edw. C. Levy Co., Melt Solutions, L.L.C.
    Inventor: Thomas M. Dunn
  • Taphole Fill Material and Method for Manufacturing the Same
    Publication number: 20120046155
    Abstract: A high-temperature, heat-resistant fill material is disclosed. The high-temperature, heat-resistant fill material includes an alumina refractory waste material having one or more of a used alumina-magnesium-carbon material, a used high-alumina material and a used fused-grain alumina material is disclosed. A method for method for manufacturing a material is also disclosed.
    Type: Application
    Filed: November 3, 2011
    Publication date: February 23, 2012
    Applicants: Melt Solutions, L.L.C., Edw. C. Levy Co.
    Inventor: Thomas M. Dunn
  • Alumina taphole fill material and method for manufacturing
    Patent number: 8062577
    Abstract: A high-temperature, heat-resistant fill material is disclosed. The high-temperature, heat-resistant fill material includes an alumina refractory waste material having one or more of a used alumina-magnesium-carbon material, a used high-alumina material and a used fused-grain alumina material is disclosed. A method for method for manufacturing a material is also disclosed.
    Type: Grant
    Filed: April 10, 2009
    Date of Patent: November 22, 2011
    Assignees: Edw. C. Levy Co., Melt Solutions, L.L.C.
    Inventor: Thomas M. Dunn