Patents Assigned to MEMC Korea Co., Ltd.
  • Polishing slurry composition and method of using the same
    Patent number: 7601273
    Abstract: A polishing slurry composition including an abrasive, a pH-adjusting agent, a water-soluble thickening agent, and a chelating agent, wherein the chelating agent includes at least one of an acetate chelating agent and a phosphate chelating agent, and a method of using the same.
    Type: Grant
    Filed: March 6, 2006
    Date of Patent: October 13, 2009
    Assignees: Cheil Industries, Inc., MEMC Korea Co., Ltd.
    Inventors: Hyun Soo Roh, Tae Won Park, Tae Young Lee, In Kyung Lee, Chin Ho Lee, Young Woo Kim, Moon Ro Choi, Jong Seop Kim