Patents Assigned to Memory & Testing Inc.
  • Stackable Semiconductor Package and Stack Method Thereof
    Publication number: 20090212409
    Abstract: A stackable semiconductor package is disclosed. In the stackable semiconductor package, land grid array (LGA) or ball grid array (BGA) semiconductor packages are stacked in the vertical direction.
    Type: Application
    Filed: April 25, 2008
    Publication date: August 27, 2009
    Applicant: Memory & Testing Inc.
    Inventor: Kyung Suk Kang