Patents Assigned to MEMSIC Semiconductor (TIANJIN) Co., Ltd.
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Patent number: 11493533Abstract: The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass.Type: GrantFiled: September 9, 2021Date of Patent: November 8, 2022Assignee: MEMSIC Semiconductor (TIANJIN) Co., Ltd.Inventors: Leyue Jiang, Yang Zhao
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Patent number: 11293938Abstract: Thermal convection based accelerometers and heating control methods therefor are described. The heating control method includes: sensing a temperature in the enclosed cavity and generating a temperature voltage signal; amplifying the temperature voltage signal to obtain an amplified temperature voltage signal; calculating a voltage difference between the amplified temperature voltage signal and a reference voltage signal; converting the voltage difference into a digital sequence by using a modulator; obtaining a heating power adjustment factor representing the voltage difference based on the digital sequence; obtaining a heating power control parameter based on the heating power adjustment factor and an initial heating power factor; converting the heating power control parameter into a switch control signal; and turning on or off a heating control switch coupling with a heating resistor for heating the enclosed cavity in series according to the switch control signal.Type: GrantFiled: October 27, 2020Date of Patent: April 5, 2022Assignee: MEMSIC Semiconductor (TIANJIN) CO., LTD.Inventors: Hongzhi Sun, Alexander Dribinsky
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Publication number: 20210405084Abstract: The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass.Type: ApplicationFiled: September 9, 2021Publication date: December 30, 2021Applicant: MEMSIC Semiconductor (TIANJIN) Co., Ltd.Inventors: Leyue Jiang, Yang Zhao
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Patent number: 11150265Abstract: The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass.Type: GrantFiled: October 28, 2020Date of Patent: October 19, 2021Assignee: MEMSIC Semiconductor (TIANJIN) Co., Ltd.Inventors: Leyue Jiang, Yang Zhao
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Publication number: 20210132107Abstract: The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass.Type: ApplicationFiled: October 28, 2020Publication date: May 6, 2021Applicant: MEMSIC Semiconductor (TIANJIN) Co., Ltd.Inventors: Leyue Jiang, Yang Zhao
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Publication number: 20210123942Abstract: The present invention discloses a thermal convection based accelerometer and a heating control method therefor. The heating control method includes: sensing a temperature in the enclosed cavity and generating a temperature voltage signal; amplifying the temperature voltage signal to obtain an amplified temperature voltage signal; calculating a voltage difference between the amplified temperature voltage signal and a reference voltage signal; converting the voltage difference into a digital sequence by using a modulator; obtaining a heating power adjustment factor representing the voltage difference based on the digital sequence; obtaining a heating power control parameter based on the heating power adjustment factor and an initial heating power factor; converting the heating power control parameter into a switch control signal; and turning on or off a heating control switch coupling with a heating resistor for heating the enclosed cavity in series according to the switch control signal.Type: ApplicationFiled: October 27, 2020Publication date: April 29, 2021Applicant: MEMSIC Semiconductor (TIANJIN) Co., Ltd.Inventors: Hongzhi Sun, Alexander Dribinsky