Abstract: The present disclosure discloses a method for wafer-level chip scale packaged wafer testing. The method comprises: dicing a wafer-level chip scale packaged wafer into a plurality of wafer strips each comprising a plurality of un-diced chip scale packaged devices; fixing the wafer strips onto a plurality of corresponding strip carriers respectively; testing the chip scale packaged devices of the wafer strips fixed onto the strip carriers by a testing equipment; and dicing the tested wafer strips into a plurality of individual chip scale packaged devices. Since the proposed method does not involve loading a multitude of diced chips into sockets one by one, but that a limited number of wafer strips are loaded onto corresponding strip carriers, flow jam is avoided.

Abstract: A composite method for measuring gas fluid flow, comprising the steps of: (a) providing a bypass pipe astride to a mechanical device for measuring gas fluid flow with a temperature sensor and a pressure sensor, (b) providing an MEMS flowrate sensor on the bypass pipe, (c) connecting the temperature sensor, the pressure sensor, the mechanical device for measuring gas fluid flow and the MEMS flowrate sensor to a data processing system, and (d) linking the data processing system with a data display system, wherein the measured data from the temperature sensor, the pressure sensor, the mechanical device for measuring gas fluid flow and the MEMS flowrate sensor is processed by the data processing system and gas fluid flow data is displayed by the data display system.