Abstract: A unit cell is disclosed that facilitates the creation of a layout of at least a portion of a microelectromechanical system. The unit cell includes a plurality of electrical traces. Some of these electrical traces pass through the unit cell. Other electrical traces extend only part way through the unit cell. At least certain boundary conditions exist for the unit cell that allow the same to be tiled in a row and in a manner that results in adjacently disposed unit cells in the row being electrically interconnected in the desired manner.

Abstract: Various embodiments of reinforced mirror microstructures for a surface micromachined optical system are disclosed. Multi-layered and structurally reinforced mirror microstructures are disclosed, including both two and three-layer microstructures. Adjacent structural layers in these multi-layered mirror microstructures may be structurally reinforced and interconnected by a plurality of vertically disposed columns, or by a plurality of at least generally laterally extending rails or ribs, or some combination thereof. Various embodiments of a single layered mirror microstructure with a structural reinforcement assembly that cantilevers from a lower surface thereof is also disclosed.

Abstract: Various embodiments of reinforced mirror microstructures for a surface micromachined optical system are disclosed. Multi-layered and structurally reinforced mirror microstructures are disclosed, including both two and three-layer microstructures. Adjacent structural layers in these multi-layered mirror microstructures may be structurally reinforced and interconnected by a plurality of vertically disposed columns, or by a plurality of at least generally laterally extending rails or ribs, or some combination thereof. Various embodiments of a single layered mirror microstructure with a structural reinforcement assembly that cantilevers from a lower surface thereof is also disclosed.

Abstract: Various embodiments of reinforced mirror microstructures for a surface micromachined optical system are disclosed. Multi-layered and structurally reinforced mirror microstructures are disclosed, including both two and three-layer microstructures. Adjacent structural layers in these multi-layered mirror microstructures may be structurally reinforced and interconnected by a plurality of vertically disposed columns, or by a plurality of at least generally laterally extending rails or ribs, or some combination thereof. Various embodiments of a single layered mirror microstructure with a structural reinforcement assembly that cantilevers from a lower surface thereof is also disclosed.

Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts.

Abstract: Various methods for forming surface micromachined microstructures are disclosed. One aspect relates to executing surface micromachining operation to structurally reinforce at least one structural layer in a microstructure. Another aspect relates to executing the surface micromachining operation to form a plurality of at least generally laterally extending etch release channels within a sacrificial material to facilitate the release of the corresponding microstructure.

Abstract: A multi-level shielded multi-conductor interconnect bus for use in interconnecting MEM devices with control signal sources and a method of fabricating a multi-level shielded multi-conductor interconnect bus are disclosed. In one embodiment, a multi-level shielded interconnect bus (410A) formed on a substrate (20) includes first and second level electrically conductive lines (42, 92) arranged in sets of one, two or more conductive lines between first and second level electrically conductive shield walls (46, 66, 96). The first and second level electrically conductive lines (42, 92) are surrounded by various layers of dielectric material (30, 50, 80, 100). A first level electrically conductive shield (78) overlies the first level electrically conductive lines (42) and shield walls (46, 66). A second level electrically conductive shield (112) overlies the second level electrically conductive lines (92) and shield walls (96).

Abstract: A shielded multi-conductor interconnect bus for use in interconnecting MEM devices with control signal sources or the like and a method of fabricating a shielded multi-conductor interconnect bus are disclosed. In one embodiment, a shielded interconnect bus formed on a substrate (20) includes a plurality of electrically conductive lines (42) arranged in sets of one, two or more conductive lines between electrically conductive shield walls (46, 66). The electrically conductive lines (42) are surrounded by layers of dielectric material (30, 50). An electrically conductive shield (78) overlies the electrically conductive lines (42) and electrically conductive shield walls (46, 66).

Abstract: A shielded interconnect bus crossover useful in interconnecting MEM devices with control signal sources or the like and a method of fabricating such a shielded interconnect bus crossover are disclosed. In one embodiment, a shielded interconnect bus crossover (10) includes a plurality of base pads (44A-C) and a plurality of support columns (74) extending upward from the base pads (44A-C) through holes formed in an interconnect bus shield (78) overlying a plurality of interconnect bus lines (42). The support columns (74) support a two layer elevated crossing line (92/112) in a spaced relation above the interconnect bus shield (78). The two layer elevated crossing line (92/112) is oriented transverse to the direction of the interconnect bus lines (42) and is located within the perimeter of a two layer rectangular crossing line shield wall (96/116).

Abstract: The present invention is generally directed to a method and assembly for supporting an actuation apparatus (e.g. a movable electrostatic comb) of a microelectromechanical (MEM) system. A suspension assembly of the present invention generally resists actuation forces inherent to electrostatically controlled MEM systems by utilizing an opposingly-directed non-linear tensile force. This can be accomplished by utilizing a suspension assembly of the invention including a longitudinal center beam and a plurality of first and second lateral beams extending out from lateral sides of the center beam. When the center beam of the suspension assembly is drawn in a first direction due to the actuation force(s), either or both of the plurality of first lateral beams and the plurality of second lateral beams are stretched to exert a non-linear tensile force having a force vector component generally oriented in a second direction generally opposite the first direction.

Abstract: An interconnect bus for a microelectromechanical system is disclosed. Various attributes for an electrical trace bus that facilitate the routing of signals throughout at least a portion of the system and/or the layout of the microelectromechanical system on a wafer are disclosed.

Abstract: A method for creating a layout of at least a portion of a microelectromechanical system is disclosed. In one embodiment, a plurality of die are formed on a wafer. Each die includes a plurality of rows of a plurality of mirror assemblies, a plurality of off-chip electrical contacts, and an electrical trace bus that is disposed between adjacent pairs of rows. This electrical trace bus is electrically interconnected with mirror assemblies in at least one of the rows. A plurality of these die are formed on a wafer. A chip is separated from the wafer such that a chip width is an integer multiple of the die width and such that a chip height is an integer number of the rows of mirror assemblies without requiring the chip height to be an integer multiple of the die height.

Abstract: A particle filter for a partially enclosed microelectromechanical systems that include a substrate material having at least one micro-device formed thereon. The particle filter includes a first structural layer forming a filter bottom and a second structural layer forming a filter wall. The filter bottom and filter wall are interconnected by at least one support feature to define a particle trap between the filter wall and filter bottom. The particle trap is a gap formed by mating, but non-interconnected portions of the filter wall and filter bottom that operates to trap and prevent particles from passing beyond the filter bottom into the microelectromechanical system.

Abstract: MEM devices are fabricated with integral dust covers, cover support posts and particle filters for reduced problems relating to particle contamination. In one embodiment, a MEM device (10) includes an electrostatic actuator (12) that drives a movable frame (14), a displacement multiplier (16) for multiplying or amplifying the displacement of the movable frame (14), and a displacement output element (18) for outputting the amplified displacement. The actuator (12) is substantially encased within a housing formed by a cover (36) and related support components disposed between the cover (36) and the substrate (38). Electrically isolated support posts may be provided in connection with actuator electrodes to prevent contact between the cover and the underlying electrodes. Such a support post may also incorporate an electric filter element for filtering undesired components from a drive signal.

Abstract: A microelectromechanical system is disclosed that constrains the direction of a force acting on a first load, where the force originates from the interaction of the first load and a second load. In particular, the direction of a force acting on the first load is caused to be substantially parallel with a motion of the first load. This force direction constraint is achieved by a force isolator microstructure that contains no rubbing or contacting surfaces. Various embodiments of structures/methods to achieve this force direction constraint using a force isolator microstructure are disclosed.

Abstract: A microelectromechanical system is disclosed that has a connector (444) between an elongate coupling/tether (400) and an elevation structure (382) that is movably interconnected with an appropriate substrate (380). A first free end (392) of the elevation structure (382) moves at least generally away from or toward the substrate (380), depending upon the direction of motion of an actuator assembly (464) that is appropriately interconnected with the tether (400). Part of the connector (444) is in compression and another part of the connector (444) is in tension, regardless of whether a pulling or pushing force is being exerted on the tether (400), and thereby the connector (444), by the actuator assembly (464).

Abstract: The present invention is generally directed to a method and assembly for elevating and supporting a microstructure of a MEM system generally by engaging a positioning system of the MEM system with a first elevator lifter. The MEM system generally includes a first microstructure (such as a mirror) disposed in vertically spaced relation to a substrate. The positioning system generally includes an actuator assembly movably interconnected with the substrate, an elevator pivotally interconnected with the substrate and further interconnected with the microstructure, and a tether interconnecting the actuator assembly and the elevator. The first elevator lifter is provided to engage the elevator to lift/elevate the microstructure away from the substrate generally after fabrication of the MEM system and prior to utilizing the microstructure in operation of the MEM system.

Abstract: The present invention provides a free space optical cross connect for switching optical signals between a plurality of optical signal ports to/from the switch interface. In one embodiment, a single chip 2N OXC (10) for switching optical signals (12) between any one of N input optical fibers (14) and any one of N output optical fibers (16) within a compact free space switch interface (18) includes N reflective microstructures (20) built/assembled on a substrate (30) and N positioning systems (40) associated with the reflective microstructures (20) that are also built/assembled on the substrate (30).

Abstract: A low voltage method and system for controlling electrically activated microelectromechanical (MEM) actuators such as electrostatic comb actuators in reflective microstructure positioning systems are provided. In one embodiment, a low voltage control system (110) includes a single fixed DC voltage source (14) and a plurality of variable DC voltage sources (16). The fixed DC voltage source (14) is electrically connected to commonly connected first terminals (12a) of a plurality of MEM actuators (12) between the MEM actuators (12) and a reference potential (18). Each variable DC voltage source (16) is associated with a separate MEM actuator (12) and is electrically connected between the reference potential (18) and a second terminal (12b) of its associated MEM actuator (12). The fixed DC voltage source supplies a fixed DC voltage that is common to the MEM actuators (12). Each variable DC source (16) supplies a controllable DC voltage to its associated MEM actuator (12).

Abstract: Various embodiments of reinforced mirror microstructures for a surface micromachined optical system are disclosed. Multi-layered and structurally reinforced mirror microstructures are disclosed, including both two and three-layer microstructures. Adjacent structural layers in these multi-layered mirror microstructures may be structurally reinforced and interconnected by a plurality of vertically disposed columns, or by a plurality of at least generally laterally extending rails or ribs, or some combination thereof. Various embodiments of a single layered mirror microstructure with a structural reinforcement assembly that cantilevers from a lower surface thereof is also disclosed.