Abstract: Various aspects of the disclose techniques relate to techniques of testing interconnects in stacked designs. A single-pulse signal, generated by a first circuit state element on a first die, is applied to a first end of an interconnect and captured at a second end of the interconnect using a clock port of a second circuit state element on a second die. A faulty interconnect may cause the single-pulse signal too distorted to reach the threshold voltage of the second circuit element.

Abstract: Aspects of the disclosed techniques relate to techniques for resist simulation in lithography. Local minimal light intensity values are determined for a plurality of sample points in boundary regions of an aerial image of a feature to be printed on a resist coating, wherein each of the local minimal light intensity values represents a minimum light intensity value for an area surrounding one of the plurality of sample points. Based on the local minimal light intensity values, horizontal development bias values for the plurality of sample points are then determined. Finally, resist contour data of the feature are determined based at least on the horizontal development bias values.

Abstract: Aspects of the disclosed techniques relate to techniques of layout decomposition for multiple patterning lithography. Data of a coloring graph are derived from layout data for a layout design. The coloring graph is simplified by repeatedly applying a plurality of graph simplification units. Each of the graph simplification units is configured to use a unique approach to simplify a graph. Based on the simplified coloring graph, the layout design is decomposed to generate decomposition information. The decomposition process may comprise applying a heuristic method for coloring if needed. The decomposition information may comprise information of one or more layout regions that cannot be decomposed.