Patents Assigned to MENTOR TECHNOLOGIES CO., LTD.
  • Heat dissipating frame structure and fabricating method thereof
    Patent number: 10690333
    Abstract: Disclosed are a heat dissipating frame structure having higher heat dissipation efficiency than the prior arts and a fabricating method thereof. Namely, the heat dissipating frame structure comprises a metal plate assembly, a part of which contacting with a heating element, and a plastic composition combined with the metal plate assembly to through the metal plate assembly receive the heat generated from the heating element.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: June 23, 2020
    Assignee: MENTOR TECHNOLOGIES CO., LTD.
    Inventor: Li Fu Chen