Patents Assigned to MERCURY SYSTEMS, INC.
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Patent number: 10096915Abstract: According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.Type: GrantFiled: February 2, 2017Date of Patent: October 9, 2018Assignee: MERCURY SYSTEMS, INC.Inventors: Darryl J. McKenney, Absu Methratta, Erica Ouellette
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Patent number: 9761972Abstract: An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.Type: GrantFiled: July 1, 2016Date of Patent: September 12, 2017Assignee: MERCURY SYSTEMS, INC.Inventors: Philip Beucler, Daniel Coolidge, Darryl J. McKenney, Kevin Jorczak
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Patent number: 9389654Abstract: Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference.Type: GrantFiled: December 3, 2013Date of Patent: July 12, 2016Assignee: MERCURY SYSTEMS, INC.Inventors: Darryl J. McKenney, Paul Zuidema, Donald Blanchet, Daniel Coolidge
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Patent number: 9246202Abstract: A circulator may include a first port having a first port impedance matching circuit defining an impedance of the first port, a second port having a second port impedance matching circuit defining an impedance of the second port, and a third port having a third port impedance matching circuit defining an impedance of the third port. In an example embodiment, the impedance of the first port may be provided to match an impedance of a first external circuit, the impedance of the second port may be provided to match an impedance of a second external circuit, and the impedance of the third port may be provided to match an impedance of a third external circuit. The impedance of the third port may be different than the impedance of the first port.Type: GrantFiled: October 10, 2013Date of Patent: January 26, 2016Assignee: MERCURY SYSTEMS, INC.Inventors: Ken Barker, David Cassens, Michael Pitchell
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Patent number: 9033750Abstract: An electrical contact is provided for mating with a mating contact. The electrical contact includes a base extending a length along a central longitudinal axis, and an arm extending a length outward from the base along the central longitudinal of the base. The arm includes a first mating bump and a second mating bump. The first and second mating bumps have respective first and second mating surfaces. The arm is configured to engage the mating contact at each of the first and second mating surfaces to establish an electrical connection with the mating contact. The first mating surface of the first mating bump is spaced apart along the length of the arm from the second mating surface of the second mating bump.Type: GrantFiled: January 16, 2013Date of Patent: May 19, 2015Assignees: TYCO ELECTRONICS CORPORATION, MERCURY SYSTEMS, INC.Inventors: Keith Edwin Miller, Chong Hun Yi, Matthew Richard McAlonis, Kevin Thackston, Dustin Carson Belack, Albert Tsang, Nicholas Paul Ruffini, Darryl J. McKenney, Erica L. Ouellette
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Publication number: 20140051294Abstract: An electrical contact is provided for mating with a mating contact. The electrical contact includes a base extending a length along a central longitudinal axis, and an arm extending a length outward from the base along the central longitudinal of the base. The arm includes a first mating bump and a second mating bump. The first and second mating bumps have respective first and second mating surfaces. The arm is configured to engage the mating contact at each of the first and second mating surfaces to establish an electrical connection with the mating contact. The first mating surface of the first mating bump is spaced apart along the length of the arm from the second mating surface of the second mating bump.Type: ApplicationFiled: January 16, 2013Publication date: February 20, 2014Applicants: MERCURY SYSTEMS, INC., TYCO ELECTRONICS CORPORATIONInventors: Keith Edwin Miller, Chong Hun Yi, Matthew Richard McAlonis, Kevin Thackston, Dustin Carson Belack, Albert Tsang, Nicholas Paul Ruffini, Darryl J. McKenney, Erica L. Ouellette