Abstract: A coupling assembly includes multiple composite substrate layers and a flange layer fusion bonded together in a stacked arrangement. The substrate layers are positioned on top of the flange layer and include embedded signal processing circuitry connected to a signal input and a signal output. A cavity is formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are coupled to the embedded signal processing circuitry and they enable the addition of a circuit element to the assembly after the fusion bonding of the flange and substrate layers, and they enable the coupling of that added element to the signal processing circuitry.

Abstract: A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements when the substrate layers are fusion bonded in a stacked arrangement. Prior to bonding, the substrate layers are milled to form gaps located at regions between the processing modules. Prior to bonding, the leads are positioned such that they extend from signal coupling points on said metalicized surfaces into the gap regions. The substrate layers are then fusion bonded to each other such that the plurality of substrate layers form signal processing modules with leads that extend from an interior of the modules into the gap areas. The individual modules may then be separated by milling the substrate layers to de-panel the modules.

Abstract: A circuit assembly includes multiple substrate with a regions of embedded signal processing circuitry can be connected to a region of adjustable signal processing circuitry and a cavity formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are connected to the embedded signal processing circuitry and/or to the customizable circuitry and enables the addition of a circuit element to the assembly after the bonding of the substrate layers and enables the connection of that added element to the signal processing circuitry and to the adjustable processing circuitry.

Abstract: A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.

Abstract: A coupling assembly includes multiple composite substrate layers and a flange layer fusion bonded together in a stacked arrangement. The substrate layers are positioned on top of the flange layer and include embedded signal processing circuitry connected to a signal input and a signal output. A cavity is formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are coupled to the embedded signal processing circuitry and they enable the addition of a circuit element to the assembly after the fusion bonding of the flange and substrate layers, and they enable the coupling of that added element to the signal processing circuitry.

Abstract: A microwave coupler is constructed in a multilayer, vertically-connected stripline architecture provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure. Such a coupler has a vertically-connected stripline structure in which multiple sets of stripline layers are separated by interstitial groundplanes, and wherein more than one set of layers has a segment of coupled stripline. A typical implementation operates at frequencies from approximately 0.5 to 6 GHz, although other frequencies are achievable.

Abstract: A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.

Abstract: A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.

Abstract: A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.

Abstract: A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. The bonded multilayers, with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module. Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.

Abstract: A microwave coupler is constructed in a multilayer, vertically-connected stripline architecture provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure. Such a coupler has a vertically-connected stripline structure in which multiple sets of stripline layers are separated by interstitial groundplanes, and wherein more than one set of layers has a segment of coupled stripline. A typical implementation operates at frequencies from approximately 0.5 to 6 GHz, although other frequencies are achievable.

Abstract: A double-balanced ring mixer is provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure. The mixer utilizes baluns comprising rectangular coaxial transmission lines that are capable of operating over a wide range of frequencies while taking up little space. A typical implementation operates at frequencies from approximately 0.9 to 6 GHz, although other frequencies, such as approximately 0.1 to 10 GHz, are achievable.

Abstract: A multilayer dielectric evanescent mode waveguide bandpass filter with resonators utilizing via hole technology is capable of achieving very narrow bandwidths with minimal insertion loss and high selectivity at microwave frequencies is provided. A typical implementation of this filter is fabricated with soft substrate multilayer dielectrics with high dielectric constant ceramics. This filter typically takes up less space than other filters presently available. A typical implementation operates at a center frequency of 1 GHz, although other center frequencies, such as approximately 0.5 GHz to approximately 60 GHz, are achievable.

Abstract: A multilayer dielectric evanescent mode waveguide bandpass filter with resonators utilizing via hole technology is capable of achieving very narrow bandwidths with minimal insertion loss and high selectivity at microwave frequencies is provided. The resonators may also be used as feed posts. A typical implementation of this filter is fabricated with soft substrate multilayer dielectrics with high dielectric constant ceramics. This filter typically takes up less space than other filters presently available. A typical implementation operates at a center frequency of 1 GHz, although other center frequencies, such as approximately 0.5 GHz to approximately 60 GHz, are achievable. The perimeter of the filter may be defined by via holes or plated slots.

Abstract: A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. The bonded multilayers, with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module. Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.

Abstract: A double-balanced microwave biphase modulator circuit is provided with a first balun for transforming the unbalanced RF Input impedance to a balanced diode impedance and providing direct current ground return paths, and a second balun for transforming the balanced diode impedance to the unbalanced RF Output impedance and providing access for data input. The first balun consists of a transmission line attached from a coupled pair of transmission lines to ground. The second balun consists of three pairs of coupled transmission lines, in which the first two pairs of transmission lines are attached to a diode ring, to a data input filter, to a circuit ground, and to the third pair of transmission lines.

Abstract: A mechanical apparatus for suturing biological tissue, or ligating a biological tube or duct, in remote or otherwise inaccessible areas such as internal body cavities. The suturing apparatus includes an elongated housing, a head assembly pivotally mounted to the elongated housing capable of independent articulation, a continuous loop belt mounted within the elongated housing and head assembly for circulation therein, an arcuate needle mounted in the head for 360.degree. rotation having a plurality of projecting means for engaging the continuous loop belt, means for articulating the head assembly from a position outside a patient's body, and means for circulating the continuous loop drive belt. A kit for suturing biological tissue, or ligating a biological tube or duct, comprising a cannula and a mechanical apparatus for suturing or ligating as described above, configured and dimensioned to be slidingly received in the cannula.

Abstract: A mechanical apparatus for suturing biological tissue including a cassette housing, a continuous loop belt mounted for circulation therein, an arcuate needle mounted within the cassette for 360.degree. rotation having a plurality of closely spaced projecting means for engaging the continuous loop belt, and means for circulating the continuous loop belt. The cassette housing is easily attachable to and detachable from the means for circulating the continuous loop belt.

Abstract: A broad band microwave stripline magic tee designed for a center microwave frequency is disclosed. The magic tee includes a pair of 3db quadrature couplers connected in tandem to one another through a 90.degree. differential phase shift circuit. Each of the 3db quadrature couplers includes a first port, a second port, a third port and a fourth port. The 90.degree. differential phase shift circuit includes first and second conductors therein having apparent electrical lengths that differ from one another by 270.degree. at the microwave center frequency. The second port of the first coupler is serially connected through the first conductor of the phase shift circuit to the first port of the second coupler, and the third port of the first coupler is serially connected through the second conductor of the phase shift circuit to the fourth port of the second coupler.