Patents Assigned to MERRY ELECTRONICS CO., LD
  • MANUFACTURING METHOD OF ELECTRONIC PACKAGING
    Publication number: 20140007425
    Abstract: A manufacturing method of electronic packaging includes the steps of preparing a metallic plate having an array of cover portions, soldering the metallic plate to a circuit board having encapsulated areas corresponding to the cover portions and employing a cutting process to obtain multiple electronic packages.
    Type: Application
    Filed: July 5, 2012
    Publication date: January 9, 2014
    Applicant: MERRY ELECTRONICS CO., LD
    Inventors: Ju-Mei LU, Yao-Min Huang, Jui-Chin Peng, Shih-Ting Yang, Chao-Ching Huang