Abstract: A demodulation image sensor, such as used in time of flight (TOF) cameras, extracts all storage- and post-processing-related steps from the pixels to another array of storage and processing elements (proxels) on the chip. The pixel array has the task of photo-detection, first processing and intermediate storage to create subframes, while the array of storage and processing elements provides accumulation into frames. Particularly, sampled values of several subframes are summed in a compressed manner. Possible compression is to use exponential function.

Abstract: A high-speed, high-sensitivity demodulation sensor usable for e.g. time-of-flight application uses a back side illuminated (BSI) image sensor chip, in which the photo-generated charges are first transferred to a demodulation area, from which the charges are then sampled and stored on at least one specific storage node. The storage node is electrically isolated from the sensitive area. Such a pixel might find its use specifically in 3D time-of-flight imaging given its improvements in sensitivity because the presented invention allows to design pixel with up to 100% fill factor and enables charge detection even if the charge generation by the photon occurs deep in the silicon substrate.

Abstract: The presented readout structure provides charge transport based readout of a photosensitive device with a minimum number of transport gates. The structure uses the given charge storage buckets of the photosensitive device, separated by a minimum sized barrier-gate, to transport the charge out of the pixel field. This new readout schema allows for a fast readout speed based on a 2 phase transport chain and increases the pixel's optical fill factor by significantly reducing the transport gate size compared to state-of-the-art pixels using a 3 or 4 phase CCD readout chain. This readout structure can be exploited for standard photo-detecting elements such as e.g. pinned photo-diodes or any enhanced pixel structure that has additional intelligence incorporated as well. Typical applications are 2D- or 3D-imaging.

Abstract: An increased sense node capacitance, mainly for 3D time-of-flight (TOF) applications, includes a storage structure that combines the advantages of gate and diffusion capacitance in order to improve the overall capacitance. The storage structure provides higher capacitance per unit area and accordingly a better fill-factor/sensitivity of the pixel; improved noise behaviour because of the use of gate capacitances, better protection against interacting signals and thus better signal quality.

Abstract: A method and system to compensate for stray light errors in time of flight (TOF) camera systems uses reference targets in the in the field of view (FOV) that can be used to measure stray light. In different embodiments, one or more reference targets are used.

Abstract: The invention describes an electronic travel aid (ETA) for blind and visually impaired persons implemented in a detachable handle of a white cane. The device enhances the functionality of the white cane giving the user more detailed information about the environment within a defined corridor of interest in front of the user with an extended range of a few meters up to 10 m. It provides a reliable warning if there is a risk of collision with obstacles including those at trunk or head height, which are not recognized by a conventional white cane. Additional sensors are integrated to delimit the defined corridor during the cane sweeping thereby reducing the amount of information that is transmitted to the user via the tactile interface. Alternatively, the device can be used independently from the cane as an object recognition and orientation aid.

Abstract: A demodulation image sensor, such as used in time of flight (TOF) cameras, performs the acquisition and readout of the pixels in parallel. This is used to avoid motion artifacts due to samplings performed separated in time.

Abstract: Improved field-of-illumination (FOI) and field-of-view (FOV) matching for 3D time-of-flight cameras is provided using light emitters with rectangular reflectors. A better adjustment of the FOI with the camera's FOV has the following advantages: optimal use of emitted light and reduced multi-path problems. Furthermore, embodiments bring the benefit for rather low-cost customization of the illumination to match the FOI to the specified FOV.

Abstract: The present invention relates to a method of simulating an initial component of a signal to approximate a component of a reference signal, the method characterized by the steps of: i. generating a source signal which includes at least one harmonic component, and ii. determining the average amplitude and duration of the source signal, and iii. referencing the amplitude of the reference signal component to be simulated, and iv. integrating the source signal over a period of time sufficient to produce a value tier the signal component amplitude approximate to the reference signal component amplitude.

Abstract: A pixel is formed in a semiconductor substrate (S) with a plane surface for use in a photodetector. It comprises an active region for converting incident light (In) into charge carriers, photogates (PGL, PGM, PGR) for generating a lateral electric potential (?(x)) across the active region, and an integration gate (IG) for storing charge carriers generated in the active region and a dump site (Ddiff). The pixel further comprises separation-enhancing means (SL) for additionally enhancing charge separation in the active region and charge transport from the active region to the integration gate (IG). The separation-enhancing means (SL) are for instance a shield layer designed such that for a given lateral electric potential (?(x)), the incident light (In) does not impinge on the section from which the charge carriers would not be transported to the integration gate (IG).

Abstract: A demodulation pixel architecture allows for demodulating an incoming modulated electromagnetic wave, normally visible or infrared light. It is based on a charge coupled device (CCD) line connected to a drift field structure. The drift field is exposed to the incoming light. It collects the generated charge and forces it to move to the pick-up point. At this pick-up point, the CCD element samples the charge for a given time and then shifts the charge packets further on in the daisy chain. After a certain amount of shifts, the multiple charge packets are stored in so-called integration gates, in a preferred embodiment. The number of integration gates gives the number of simultaneously available taps. When the cycle is repeated several times, the charge is accumulated in the integration gates and thus the signal-to-noise ratio increases. The architecture is flexible in the number of taps. A dump node can be attached to the CCD line for dumping charge with the same speed as the samples are taken.

Abstract: Due to their parallel illumination and acquisition for all the pixels, today's state-of-the-art time-of-flight (TOF) range cameras suffer from erroneous measurements caused by multiple reflections in the scene. The invention proposes to compensate for the multi-path fusing the results obtained by applying two spatially different illumination schemes, typically one to achieve highest possible lateral resolution and for the second one structuring the emitted light and by doing so lowering the lateral resolution but limiting the impact of multiple reflections.

Abstract: A two-dimensional, temporally modulated electromagnetic wavefield, preferably in the ultraviolet, visible or infrared spectral range, can be locally detected and demodulated with one or more sensing elements. Each sensing element consists of a resistive, transparent electrode (E) on top of an insulated layer (O) that is produced over a semiconducting substrate whose surface is electrically kept in depletion. The electrode (E) is connected with two or more contacts (C1; C2) to a number of clock voltages that are operated synchronously with the frequency of the modulated wavefield. In the electrode and in the semiconducting substrate lateral electric fields are created that separate and transport photogenerated charge pairs in the semiconductor to respective diffusions (D1; D2) close to the contacts (C1; C2).

Abstract: A method for filtering distance information from a 3D-measurement camera system comprises comparing amplitude and/or distance information for pixels to adjacent pixels and averaging distance information for the pixels with the adjacent pixels when amplitude and/or distance information for the pixels is within a range of the amplitudes and/or distances for the adjacent pixels. In addition to that the range of distances may or may not be defined as a function depending on the amplitudes.

Abstract: A new pixel in semiconductor technology comprises a photo-sensitive detection region (1) for converting an electromagnetic wave field into an electric signal of flowing charges, a separated demodulation region (2) with at least two output nodes (D10, D20) and means (IG10, DG10, IG20, DG20) for sampling the charge-current signal at least two different time intervals within a modulation period. A contact node (K2) links the detection region (1) to the demodulation region (2). A drift field accomplishes the transfer of the electric signal of flowing charges from the detection region to the contact node. The electric signal of flowing charges is then transferred from the contact node (K2) during each of the two time intervals to the two output nodes allocated to the respective time interval. The separation of the demodulation and the detection regions provides a pixel capable of demodulating electromagnetic wave field at high speed and with high sensitivity.

Abstract: The pixel for use in an image sensor comprises a low-doped semiconductor substrate (A). On the substrate (A), an arrangement of a plurality of floating areas, e.g., floating gates (FG2-FG6), is provided. Neighboring floating gates are electrically isolated from each other yet capacitively coupled to each other. By applying a voltage (V2?V1) to two contact areas (FG1, FG7), a lateral steplike electric field is generated. Photogenerated charge carriers move along the electric-field lines to the point of highest potential energy, where a floating diffusion (D) accumulate the photocharges. The charges accumulated in the various pixels are sequentially read out with a suitable circuit known from image-sensor literature, such as a source follower or a charge amplifier with row and column select mechanisms. The pixel of offers at the same time a large sensing area, a high photocharge-detection sensitivity and a high response speed, without any static current consumption.

Abstract: The presented readout structure provides charge transport based readout of a photosensitive device with a minimum number of transport gates. The structure uses the given charge storage buckets of the photosensitive device, separated by a minimum sized barrier-gate, to transport the charge out of the pixel field. This new readout schema allows for a fast readout speed based on a 2 phase transport chain and increases the pixel's optical fill factor by significantly reducing the transport gate size compared to state-of-the-art pixels using a 3 or 4 phase CCD readout chain. This readout structure can be exploited for standard photo-detecting elements such as e.g. pinned photo-diodes or any enhanced pixel structure that has additional intelligence incorporated as well. Typical applications are 2D- or 3D-imaging.

Abstract: A pixel for detecting incident radiation (In) over a large area with high sensitivity and low power consumption. The pixel comprises a semiconductor substrate (1), covered by a thin insulating layer (2), on top of which a dendritic or arborescent gate structure (3) is arranged. The dendritic gate (3) is electrically connected at two or more contacts (C1, C2) with voltage sources, leading to the flow of a current and a position-dependent potential distribution in the gate (3). Due to the use of arborescent structures and various materials (31, 32), the pixel can be optimized for a certain application, in particular in terms of the electric field distribution, the RC time constant, the power consumption and the spectral sensitivity. Due to its compact size, the photo sensor can be arranged in linear or two-dimensional manner for the realization of line and area sensors.

Abstract: A pixel is formed in a semiconductor substrate (S) with a plane surface for use in a photodetector. It comprises an active region for converting incident light (In) into charge carriers, photogates (PGL, PGM, PGR) for generating a lateral electric potential (?(x)) across the active region, and an integration gate (IG) for storing charge carriers generated in the active region and a dump site (Ddiff). The pixel further comprises separation-enhancing means (SL) for additionally enhancing charge separation in the active region and charge transport from the active region to the integration gate (IG). The separation-enhancing means (SL) are for instance a shield layer designed such that for a given lateral electric potential (?(x)), the incident light (In) does not impinge on the section from which the charge carriers would not be transported to the integration gate (IG).

Abstract: An integrated sensor chip comprises at least one pixel. The at least one pixel comprises: one or several integration regions for receiving and storing photogenerated charges; a modulation region that moves the photogenerated charges to be stored in the at least two integration regions; and sense nodes, in which each of the sense nodes is associated with one of the integration regions, into which the photogenerated charges are moved from the integration regions during a readout stage.