Abstract: A cleaning and sanitizing assembly for automatic food and beverage dispensing machines is provided. The dispensing machine may be manufactured or retrofitted with the assembly. The assembly may also be a stand-alone assembly. The assembly includes at least one water line and at least one sanitizer line to introduce at least one sanitizer to conditioned water from the at least one water line. The at least one sanitizer may be ozone generated by an ozone generator from air filtered and dried in an air filter/dryer and then added to the water in an air flow apparatus. Other sanitizers may be added to the ozonated water or the conditioned water without the ozone. The sanitized water is introduced into the dispensing machine typically through a reservoir which normally contains the produce mix. The sanitized water is dispersed into the reservoir through a rinse tube or a spray nozzle extending across the top of each reservoir.

Abstract: The present invention is directed to an improved frozen drink and dessert dispenser and method therefor. The improved frozen drink and dessert dispenser and method permits the simultaneous or alternate dispensing of two products. Further, through a dispensing valve system controlled by a controller, residue of dispensed product is purged from the product dispenser prior to the dispensing of the next serving of product and product may be dispensed in predetermined amounts. The improved frozen drink and desert dispenser and method also permits the automated cleaning of substantially all of the dispenser without any significant disassembly of the dispenser.

Abstract: A testable tape for forming electrical innerlead connections between conductive pads, such as in semiconductor die, and a process for manufacturing the testable tape are disclosed. The testable tape includes a plurality of leads arranged in a pattern to form the innerlead bonds to the die. The plurality of leads is supported with a dielectric fill formed selectively on the lead pattern to support and electrically isolate the leads for testing.

Abstract: A semiconductor die bonding machine for the electrical connection of the contact pads of a semiconductor die with the leads of a die holding device, such as a printed circuit board or main leadframe. The bonding machine utilizes micro leadframes formed in an aluminum foil tape and has an alignment mechanism which permits the rapid, mechanized bonding of the contact pads to the leads of the die holding device.