Patents Assigned to Mesa Technology
  • Testable tape for bonding leads to semiconductor die and process for manufacturing same
    Patent number: 4510017
    Abstract: A testable tape for forming electrical innerlead connections between conductive pads, such as in semiconductor die, and a process for manufacturing the testable tape are disclosed. The testable tape includes a plurality of leads arranged in a pattern to form the innerlead bonds to the die. The plurality of leads is supported with a dielectric fill formed selectively on the lead pattern to support and electrically isolate the leads for testing.
    Type: Grant
    Filed: February 9, 1984
    Date of Patent: April 9, 1985
    Assignee: Mesa Technology
    Inventor: Larry J. Barber
  • Semiconductor die bonding machine
    Patent number: 4407440
    Abstract: A semiconductor die bonding machine for the electrical connection of the contact pads of a semiconductor die with the leads of a die holding device, such as a printed circuit board or main leadframe. The bonding machine utilizes micro leadframes formed in an aluminum foil tape and has an alignment mechanism which permits the rapid, mechanized bonding of the contact pads to the leads of the die holding device.
    Type: Grant
    Filed: February 23, 1981
    Date of Patent: October 4, 1983
    Assignee: Mesa Technology
    Inventor: John J. Manning