Abstract: The invention concerns a method for making a card with tips for testing semiconductor chips with microsphere bond pads. A first adhesive coat is vacuum deposited on a flexible polyimide film, followed by a second metal coat. A combination of UV photolithography and electroforming of a metal material enables to obtain the implantation of the tips. The pattern of the strip conductors is obtained by a second UV lithography operation whereby the second metal layer and the first adhesive coat are etched. An insulating protective resist is deposited on the active conductive zone. The flexible film is mounted on a truncated maintaining component whereof the vertical translational and planar rotational movements are made possible by a guide supported on a spring suspension. The defective alignment between the plane of the tips and the plane of the tips and the printed circuit plane is corrected by a correcting system with three support points adjustable with screws.

Abstract: The invention concerns a housing box for an electronic chip with biological probes, comprising a flat support device formed by assembling a first lower support and a second upper support, whereof one is equipped with a connector for activating the chip, a plurality of electrical connections extending along the assembly interface and cooperating with electrical connecting means ensuring the continuity of the electrical connections with the chip strip conductors. Protective means are placed in the environment of the chip to obtain an electrical and biological insulating effect for the active part with respect to the input and output contacts of the connector. The invention is useful for molecular analysis, in particular of DNA or any other biological reaction.

Abstract: The invention relates to a process for manufacturing a card with multiple tips, designed in particular for testing semiconductor chips or integrated circuits before encapsulation thereof and comprising an oxidised silicon substrate 10 on the two opposite surfaces, one of the surfaces being provided with conducting strips connected to contacts in the form of tips 26. A thin metal layer 22 is deposited by vapour deposition in a vacuum or by cathode sputtering on one of the insulated surfaces of the monolithic substrate 10, and the conducting strips are obtained by means of a UV photolithography operation making use of a photosensitive resin, followed by etching of the thin metal layer 22 according to the location and shape of the tips 26. Another UV photolithography operation is then performed consisting in depositing a thick layer 24 of photosensitive resin on the thin etched layer, the resin then being revealed with the drawing 25 of the tips.