Abstract: A structural capacitor includes a first carbon fiber material layer, a second carbon fiber material layer, and an interlayer dielectric including a diamond-like-carbon material layer.
Type:
Grant
Filed:
August 10, 2011
Date of Patent:
June 24, 2014
Assignee:
Mesoscribe Technologies, Inc.
Inventors:
William G. Baron, Jeffrey A. Brogan, Sandra Fries-Carr, Richard J. Gambino, Christopher Gouldstone, Brian Keyes, Sanjay Sampath, Huey-Daw Wu, Richard L. C. Wu
Abstract: A thermocouple disposed on a substrate comprises a first leg of thermoelectric material, a second leg of thermoelectric material, and a thermocouple junction electrically connecting the first leg and the second leg, wherein a height of the thermocouple junction is substantially a height of the first or second legs.
Type:
Grant
Filed:
April 2, 2007
Date of Patent:
July 13, 2010
Assignee:
Mesoscribe Technologies, Inc.
Inventors:
Richard J. Gambino, Jon Patrick Longtin, Jeffrey A. Brogan, Jonathan S. Gutleber, Robert J. Greenlaw