Abstract: The invention relates to a method for mechanically removing solder beads (14) from the surface of printed circuit boards (10) directly after they pass through the solder flow during flow soldering of printed circuit boards in a soldering plant. In order to ensure that the solder beads are mechanically removed without damaging the printed circuit boards, the solder beads (14) are mechanically removed by means of at least one jet (50) of cold gas directed onto the surface.
Type:
Grant
Filed:
July 25, 1997
Date of Patent:
June 15, 1999
Assignee:
Messer Greishiem
Inventors:
Jens Tauchmann, Tilman Schwinn, Heinz-Olaf Lucht