Abstract: A lead-free solder alloy includes a tin-copper alloy that also includes a minor amount of cobalt, which has been found to provide a shiny and reflective appearance to the solder alloy. Methods of soldering using such an alloy, as well as a solder joint including such an alloy also are disclosed.

Abstract: The present invention relates to a method for sealing an end of a pipe, to an external sealing surface. The method includes providing a pipe assembly which includes a pipe and a flange. The pipe includes a proximal pipe end and a flared end region. The flared end region is integral with the pipe and is proximate to and continuous with the proximal pipe end. The flange is non-integrally disposed around the pipe distal to the pipe's flared end region. The method further includes securing, non-integrally and distally to the pipe's flared end region, the flange to the pipe so that proximal movement of the flange relative to the pipe is restricted. The flange is drawn toward the external sealing surface, which causes the flange sealing surface to bias the pipe's flared end region into sealing contact with the external sealing surface. Pipe assemblies which include a backup ring having a tapered inside surfaces and a flange having tapered outside surfaces are also discussed.