Patents Assigned to METALLIC RESOURCES, INC.
  • Lead-Free Solder Alloy
    Publication number: 20090008434
    Abstract: A lead-free solder alloy includes a tin-copper alloy that also includes a minor amount of cobalt, which has been found to provide a shiny and reflective appearance to the solder alloy. Methods of soldering using such an alloy, as well as a solder joint including such an alloy also are disclosed.
    Type: Application
    Filed: September 5, 2008
    Publication date: January 8, 2009
    Applicant: METALLIC RESOURCES, INC.
    Inventor: Stanley R. Rothschild