Abstract: A method for applying an underfill and edge coating to a flip chip is described. The method includes the steps of adhering a bumped wafer to an expandable carrier substrate, sawing the wafer to form individual chips, stretching the carrier substrate in a bidirectional manner to form channels between each of the individual chips, applying an underfill material to the bumped surfaces of the chips and around the edges of the chips, cutting the underfill material in the channels between the chips and removing the individual, underfill coated chips from the carrier.

Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.

Abstract: A post-treatment method for copper on printed circuit boards is disclosed. The method comprises forming a cupric-based organometallic conversion coating on a copper surface of a printed circuit board, and then converting the cupric-based organometallic conversion coating to a cuprous-based organometallic conversion coating. The resulting cuprous-based organometallic conversion coating is desirable in that it improves copper to dielectric bond integrity.

Abstract: The present invention is directed to a multi-part form, for use in forming an inner wall of a mold. The multi-part form includes a consumable exterior wall for contacting a casting compound. A collapsible intermediate wall contacts an inner side of the exterior wall and an interior wall is slidably engaged with the intermediate wall. The present invention is also directed to a method of forming a containment member for molten metal. A mold having an inner wall is provided. The inner wall includes a consumable exterior wall for contacting a casting compound, a collapsible intermediate wall that contacts an inner side of the exterior wall and an interior wall that is slidably engaged with the intermediate wall. Also provided is an outer wall that substantially surrounds the inner wall and defines a space between the outer wall and the inner wall. Casting compound is poured into the space and the casting compound is allowed to set.

Abstract: A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.

Abstract: The present invention relates to a process for forming a two-stage bump on a flip chip. The process employs an underfill material which can be formed to act as a mask for application of bumps formed from a first composition to the flip chip. A material having a different composition can then be applied to the bumps.

Abstract: A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The device is characterized in that the underfill material is provided on the chip surface prior to the application of solder bumps, and then treated to form apertures therein which act as a mask for solder bump application. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.

Abstract: The mounting assembly is for adjustably mounting an accessory having a substantially planar portion onto a rail member having a longitudinal side channel with opposite longitudinal folds. The mounting assembly has an elongated latch member shaped for passage between the folds when the latch member is oriented substantially parallel to the channel, and for abutment against the folds when the latch member is turned at least partially transversely inside the channel. The mounting assembly has a tightening device for tightening the accessory to the latch member. A locking device is operatively associated with the planar portion of the accessory and the latch member to prevent relative rotation and translation thereof when the accessory is tighten to the latch member.

Abstract: An overhead guard for a vehicle, in the form of a cab for a lift truck, that affords both protection and a high degree of overhead visibility with a relatively open grille work of steel bar and an impact-resistant glazing sheet. The glazing sheet is sandwiched between a rigid framework and a sheet metal panel having a large cutout for the overhead view. Gusset plates reinforce the corners of the framework and provide convenient mounting locations for an air circulating fan. Threshold adaptor brackets are mounted in step pockets of the vehicle chassis to simplify the door structure while permitting the cab to be effectively sealed from the environment when the doors are closed.

Abstract: Mold compounds for encapsulating semiconductors are disclosed. The compounds achieve high levels of adhesion to uncleaned printed wiring board substrates by minimizing the level of silicone fluid in the compound. Methods for encapsulating semiconductor dies and processes for encapsulating the dies also are disclosed.

Abstract: A flip chip having solder bumps and an integrated flux and underfill, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required separate fluxing and underfilling steps.

Abstract: A set of panel assemblies for enclosing the overhead guard of a vehicle such as a skid steer comprising a windshield/door assembly and side window assemblies. The windshield/door assembly includes a door jamb that is clamped over the front corner posts of the overhead guard and a windshield/door unit hinged on the jamb. The windshield/door unit seals against a generally planar front face of the jamb. The side window assemblies comprise transparent rigid plastic sheets adapted to be attached to the side grille of the overhead guard in a simplified manner and without occupying excessive space in the clearance area between the overhead guard and operating elements such as the lift arms of a bucket.