Patents Assigned to METALTECH CO., LTD.
-
Publication number: 20240136249Abstract: There is provided an aluminum-ceramic bonded substrate in which an aluminum plate comprising aluminum alloy is directly bonded to one surface of a ceramic substrate and an aluminum base plate comprising aluminum alloy is directly bonded to the other surface of the ceramic substrate, wherein the aluminum alloy is the aluminum alloy containing 0.05% by mass or more and 3.0% by mass or less of at least one element selected from nickel and iron in total amount, containing 0.01% by mass or more and 0.1% by mass or less of at least one element selected from titanium and zirconium in total amount, and containing 0% by mass or more and 0.05% by mass or less of at least one element selected from boron or carbon in total amount, with a balance being aluminum.Type: ApplicationFiled: December 10, 2021Publication date: April 25, 2024Applicant: DOWA METALTECH CO., LTD.Inventor: Koji KOBAYASHI
-
Patent number: 11946129Abstract: To provide, as a sheet material of a Cu—Ni—Al based copper alloy having a compositional range exhibiting a whitish metallic appearance that is excellent in “strength-bending workability balance” and is excellent in discoloration resistance, a copper alloy sheet material having a composition containing, in terms of % by mass, Ni: more than 12.0% and 30.0% or less, Al: 1.80-6.50%, Mg: 0-0.30%, Cr: 0-0.20%, Co: 0-0.30%, P: 0-0.10%, B: 0-0.05%, Mn: 0-0.20%, Sn: 0-0.40%, Ti: 0-0.50%, Zr: 0-0.20%, Si: 0-0.50%, Fe: 0-0.30%, and Zn: 0-1.00%, with the balance of Cu and unavoidable impurities, and satisfying Ni/Al?15.0, and having a metallic structure having, on an observation plane in parallel to a sheet surface (rolled surface), a number density of fine secondary phase particles having a particle diameter of 20 to 100 nm of 1.0×107 per mm2 or more.Type: GrantFiled: August 20, 2019Date of Patent: April 2, 2024Assignee: DOWA METALTECH CO., LTD.Inventors: Toshiya Shutoh, Hisashi Suda
-
Patent number: 11946127Abstract: [Object] To provide a Cu—Ti-based copper alloy sheet material having a strength, an electrical conductivity, bending workability, and a stress relaxation property all at high levels in a good balance, and also having a reduced density (specific gravity). [Means for Solution] A copper alloy sheet material composed of, in mass %, Ti: 1.0 to 5.0%, Al: 0.5 to 3.0%, Ag: 0 to 0.3%, B: 0 to 0.3%, Be: 0 to 0.15%, Co: 0 to 1.0%, Cr: 0 to 1.0%, Fe: 0 to 1.0%, Mg: 0 to 0.5%, Mn: 0 to 1.5%, Nb: 0 to 0.5%, Ni: 0 to 1.0%, P: 0 to 0.2%, Si: 0 to 0.5%, Sn: 0 to 1.5%, V: 0 to 1.0%, Zn: 0 to 2.0%, Zr: 0 to 1.0%, S: 0 to 0.2%, rare earth elements: 0 to 3.0%, and the balance substantially being Cu, wherein a maximum width of a grain boundary reaction type precipitate existing region is 1000 nm or less, a KAM value when a boundary with a crystal orientation difference of 15° or more measured by EBSD (step size: 0.1 ?m) is rewarded as a crystal grain boundary is 3.Type: GrantFiled: March 8, 2023Date of Patent: April 2, 2024Assignee: DOWA METALTECH CO., LTD.Inventors: Takuya Hashimoto, Hiroshi Yorifuji, Hiroshi Hyodo
-
Patent number: 11926917Abstract: There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.Type: GrantFiled: June 10, 2020Date of Patent: March 12, 2024Assignee: DOWA METALTECH CO., LTD.Inventors: Yukiya Kato, Hirotaka Kotani, Tatsuhiro Doi, Takao Tomiya, Hiroto Narieda
-
Patent number: 11920255Abstract: There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.Type: GrantFiled: June 4, 2020Date of Patent: March 5, 2024Assignee: Dowa Metaltech Co., Ltd.Inventors: Hirotaka Kotani, Yukiya Kato, Tatsuhiro Doi, Takao Tomiya, Hiroto Narieda
-
Patent number: 11919288Abstract: To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materials 21 and 22 and a carbon material 10 having the following property (A) bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m2 or more.Type: GrantFiled: September 8, 2021Date of Patent: March 5, 2024Assignee: DOWA METALTECH CO., LTD.Inventors: Hideyo Osanai, Akira Sugawara
-
Patent number: 11898263Abstract: There is provided an inexpensive plated product, which can prevent the increase of the contact resistance of a silver-plating film and the change of the color of the surface thereof after reflow-treating a plated product wherein the silver-plating film is formed on a portion of the surface thereof and wherein a tin-plating film is formed on a portion of the other portion of the surface thereof, and a method for producing the same.Type: GrantFiled: January 22, 2020Date of Patent: February 13, 2024Assignee: DOWA METALTECH CO., LTD.Inventors: Yutaro Hirai, Kentaro Arai, Shunsuke Ashidate
-
Publication number: 20240026558Abstract: There is provided an Ag-plated material and a related technique, including: an Ag-plated layer on a substrate that comprises a conductive metal; and a plurality of two-layer plating structures on the substrate, the two-layer plating structures having a porous Ni-plated layer and an Ag-plated layer in this order from a substrate side.Type: ApplicationFiled: July 14, 2021Publication date: January 25, 2024Applicant: DOWA METALTECH CO., LTD.Inventors: Yosuke SATO, Yutaro HIRAI, Kentaro ARAI
-
Publication number: 20240018680Abstract: There is provided an Ag-coated material and its related technique, including a base material and an Ag film on the base material, the Ag film including alternately laminated at least three Ag layers with average crystal grain sizes different by three times or more.Type: ApplicationFiled: July 14, 2021Publication date: January 18, 2024Applicant: DOWA METALTECH CO., LTD.Inventors: Yosuke SATO, Yutaro HIRAI, Kentaro ARAI
-
Publication number: 20230313402Abstract: There are provided a silver-plated product having a more excellent wear resistance than that of conventional silver-plated products, and a method for producing the same. The method comprises the steps of: preparing a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzothiazole or a derivative thereof; and forming a surface layer of silver on a base material by electroplating at a liquid temperature and at a current density in the silver-plating solution so as to satisfy (BC/A)2/D?10 (° C.2·dm2/A) assuming that a concentration of free cyanide in the silver-plating solution is A (g/L), that a concentration of a benzothiazole content of the benzothiazole or derivative thereof in the silver-plating solution is B (g/L), that the liquid temperature of the silver-plating solution is C (° C.) and that the current density during the electroplating is D (A/dm2).Type: ApplicationFiled: March 24, 2021Publication date: October 5, 2023Applicant: DOWA METALTECH CO., LTD.Inventors: Yutaro Hirai, Kentaro Arai, Yosuke Sato
-
Publication number: 20230298961Abstract: An insulating substrate in which one principal surface of a heat-dissipation-side metal plate is bonded to one principal surface of a ceramic substrate via a brazing material layer provided therebetween, and a solder resist portion is formed on at least one selected from a periphery of the other principal surface of the heat-dissipation-side metal plate, a side surface of the heat-dissipation-side metal plate, and a surface of the brazing material layer. A solder resist prevents solder from wrapping around the brazing material layer, and thereby, what is called “the brazing material layer leaching into solder” no longer occurs and the occurrence of cracks inside the brazing material layer is avoided. This prevents stress concentration from occurring in the ceramic substrate at an inner portion relative to an end portion of the heat-dissipation-side metal plate.Type: ApplicationFiled: June 29, 2021Publication date: September 21, 2023Applicant: DOWA METALTECH CO., LTD.Inventors: Seiya YUKI, Takashi IDENO, Eitarou SATOU, Yukihiro KITAMURA
-
Patent number: 11761108Abstract: A mask for partial plating capable of performing partial electroplating selectively on a prescribed portion on a surface of an electrically isolated metal member provided on an insulated board is provided. Methods for producing an insulated circuit board and using the mask for partial plating are also provided. The mask for partial plating includes an insulated sheet member having an opening corresponding to the portion to be plated, and a structure including a partial region on one surface in the thickness direction of the insulated sheet member being coated with one or plural conductive sheet members attached to the region. The conductive sheet member is adhered to the surface of the insulated sheet member, for example, with an adhesive or an adhesive member. The conductive sheet member may be engaged in a recessed portion formed on the surface of the insulated sheet member.Type: GrantFiled: October 27, 2021Date of Patent: September 19, 2023Assignee: DOWA METALTECH CO., LTD.Inventors: Masaaki Higo, Satoru Ideguchi
-
Publication number: 20230268245Abstract: An insulating substrate in which one principal surface of a heat-dissipation-side metal plate is brazed to one principal surface of a ceramic substrate via a brazing material layer provided therebetween, in which a Ni plating layer that covers the brazing material layer exposed between the ceramic substrate and the heat-dissipation-side metal plate is provided, and at least a portion of the other principal surface of the heat-dissipation-side metal plate is not covered with a Ni plating layer, leaving the surface of the heat-dissipation-side metal plate exposed. According to the present invention, it becomes possible to obtain the insulating substrate having excellent furnace passing resistance of the insulating substrate (alone) and further having excellent heat cycle characteristics in a state of a heat sink plate being soldered to the insulating substrate.Type: ApplicationFiled: June 29, 2021Publication date: August 24, 2023Applicant: DOWA METALTECH CO., LTD.Inventors: Seiya YUKI, Takashi IDENO, Junichi KINOSHITA, Yukihiro KITAMURA
-
Publication number: 20230175160Abstract: A composite material including a composite film formed on a base material, the composite film including a silver layer containing carbon particles, wherein a content of Sb in the composite film is 1 mass % or less, and a crystallite size of silver in the composite film is 40 nm or less.Type: ApplicationFiled: April 21, 2021Publication date: June 8, 2023Applicant: DOWA METALTECH CO., LTD.Inventors: Yukiya KATO, Hirotaka TAKAHASHI, Tatsuhiro DOI, Hirotaka KOTANI, Takao TOMIYA, Hiroto NARIEDA
-
Publication number: 20230142395Abstract: The present invention provides a silver-plated member with a surface layer made of a silver-plating layer being formed on a base member, wherein a crystal plane of the surface layer has a {110} plane preferential orientation, and the orientation proportion of the {110} plane is 30% or more and 75% or less.Type: ApplicationFiled: December 21, 2020Publication date: May 11, 2023Applicant: DOWA METALTECH CO., LTD.Inventors: Yutaro HIRAI, Kentaro ARAI, Yosuke SATO
-
Publication number: 20230097787Abstract: A silver-plated product having a higher hardness and more excellent wear resistance than those of conventional silver-plated products, and a method for producing the same.Type: ApplicationFiled: January 14, 2021Publication date: March 30, 2023Applicant: DOWA METALTECH CO., LTD.Inventors: Yutaro Hirai, Kentaro Arai, Yosuke Sato
-
Publication number: 20230093655Abstract: A silver-plated product which has more excellent minute sliding abrasion resistance property than that of conventional silver-plated products, and a method for producing the same. The silver-plated product is produced by electroplating a base material 10 of copper or a copper alloy to form an underlying plating layer 12 of nickel or a nickel alloy, a first silver-plating layer of silver (lower silver-plating layer) 14, a zinc-plating layer 16 of zinc serving as an intermediate plating layer, and a second silver-plating layer of silver (upper silver-plating layer) 18 serving as a surface layer, in this order from the base material 10.Type: ApplicationFiled: January 21, 2021Publication date: March 23, 2023Applicant: DOWA METALTECH CO., LTD.Inventors: Yutaro Hirai, Kentaro Arai, Yosuke Sato
-
Publication number: 20230068210Abstract: Provided are a brazing material in paste form containing a powder mixture that contains titanium powder having an average particle diameter (D50) of 20 ?m or less in an amount of 0.7 to 2.0 mass %, copper powder in an amount of 3 to 15 mass %, and silver powder as the remaining portion, and a vehicle, and techniques associated with the brazing material.Type: ApplicationFiled: March 18, 2021Publication date: March 2, 2023Applicant: DOWA METALTECH CO., LTD.Inventor: Ayumu OZAKI
-
Patent number: 11591673Abstract: There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.0% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, wherein the total of the content of silicon and six times as much as the content of phosphorus is 1% by weight or more and wherein the copper alloy plate has a crystal orientation satisfying I{220}/I{420}?2.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.Type: GrantFiled: February 20, 2019Date of Patent: February 28, 2023Assignee: DOWA METALTECH CO., LTD.Inventors: Naota Higami, Takanobu Sugimoto, Kazuki Yoshida, Hiroto Narieda
-
Publication number: 20230046780Abstract: There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.Type: ApplicationFiled: June 10, 2020Publication date: February 16, 2023Applicant: DOWA METALTECH CO., LTD.Inventors: Yukiya KATO, Hirotaka KOTANI, Tatsuhiro DOI, Takao TOMIYA, Hiroto NARIEDA