Abstract: The present application is directed to a power conversion device, comprising a switch element, a magnetic core, a first substrate and a second substrate, wherein the magnetic core is assembled to the second substrate, and the switch element is disposed on the upper surface of the first substrate.

Abstract: The present application discloses a stacked power module. A bonding material and solder are provided between stacked layers, and the moment when the bonding material is fully cured is later than the moment when the solder begins to melt, thereby achieving the reliability of the assembly of the stacked layers, and improving the production yield of the stacked power module. On the other hand, the present application further provides an assembly mode of the stacked power module and a system board. For different pin layouts of a lower surface of the stacked power module, several different assembly modes of the stacked power module and the system board are proposed, and the reliability of the assembly process of the stacked power module and the system board is also improved.

Abstract: The present application discloses a multiphase power supply module structure for high-frequency multiphase BUCK circuits with paralleled connection and anti-coupling technology. On the one hand, the multiphase high-frequency BUCK circuits are integrated in a single power supply module; on the other hand, by optimizing the magnetic core structure and the winding structure, the output inductance of the multiphase BUCK circuits is reversely coupled, the volume of the magnetic component is further reduced, and the power density and dynamic performance of the multi-phase power supply module are improved.

Abstract: A power conversion apparatus including a full-bridge circuit, two magnetic cores, and four synchronous rectification circuits is provided. The full-bridge circuit comprises two upper switches, two middle switches, a resonant capacitor, a first high-voltage winding and a second high-voltage winding; each of the synchronous rectification circuits comprises a first lower switch, a second lower switch, a first low-voltage winding and a second low-voltage winding; and further comprising an input terminal and an output terminal, wherein the input terminal comprises an input positive terminal and a GND terminal, and the output terminal comprises an output positive terminal and a GND terminal.

Abstract: The present invention discloses a power supply module and a vertical power delivery system. The power supply module comprises a large-area pin board, a control module, a plurality of power blocks, a plurality of input capacitors, and a plurality of output capacitors. The controller is vertically connected to the pin board by means of a first side surface or a third side surface, so as to realize electrical connection. In the present invention, the controller is placed vertically, and as many power blocks are provided in a limited space in the power supply module, the power density or conversion efficiency of the power supply module is improved.

Abstract: The present invention provides a circuit connection mode for a power conversion device, which can meet requirements of different gain ratios of input and output voltages and application scenarios of various output powers. Furthermore, with a simple magnetic core structure, a winding manner is provided, thereby further reducing the volume and loss of the magnetic assembly, and improving the power density of the power conversion device.

Abstract: The present application provides a module structure with high efficiency and good heat dissipation performance, which improves the heat dissipation capability of the VRM module by means of the design of the self-contained heat sink, so as to improve the output power of the VRM module; by means of the device placement in the VRM module, the parasitic parameters on the power transmission path are reduced, and the conversion efficiency of the VRM module is improved; and the dynamic performance of the VRM module is further improved by means of the TLVR technology.

Abstract: A high-power power conversion device includes: a first high-voltage sub-circuit, a second high-voltage sub-circuit, a first low-voltage sub-circuit, a second low-voltage sub-circuit, an input positive terminal, an input negative terminal, an output positive terminal, and an output negative terminal. Under the condition that high-power output is met, the volume and loss of the high-power power conversion device are further reduced, and a steady-state performance and a dynamic performance of the high-power power conversion device are improved. A voltage equalization control scheme is also provided to achieve voltage equalization between the two high-voltage sub-circuits.

Abstract: A power supply architecture includes a plurality of front-stage circuit units, a plurality of post-stage circuit units, and a plurality of combined output ends. Each of the front-stage circuit units includes an input end and an output end, each of the post-stage circuit units includes an input end and an output end, and the input ends of the front-stage circuit units are electrically connected. Each of the combined output ends is an output end of one front-stage circuit unit or output ends electrically connected to the plurality of the front-stage circuit units. Each of the combined output ends is electrically connected to at least one input end of one post-stage circuit unit. A front-stage circuit unit of the front-stage circuit units and a post-stage circuit unit of the post-stage circuit units, which are electrically connected to the same combined output end, constitute a series combination.

Abstract: A power supply module including a top surface and a bottom surface opposite to each other, a IPM unit and a plurality of pins; the pins including a signal pin and a power pin; the IPM unit including two power semiconductor bridges; the IPM unit is disposed adjacent to the top surface of the power supply module; the pins are disposed on the bottom surface of the power supply module. A signal pin pasting layer, a magnetic element and a DC power pin wiring are disposed between the pins and the IPM unit; the signal pin pasting layer transmits signals between the IPM unit and the bottom surface of the power supply module. The signal pin pasting layer including an insulating material and a conductive layer. The magnetic element including a side surface, a top surface and a bottom surface opposite to each other, a core and two AC windings.

Abstract: A power supply module including a substrate, a magnetic assembly, and an element layer is provided. The magnetic assembly is arranged above a semiconductor switching device, and a common end of the semiconductor switching device is arranged on an upper surface of the switching device and is connected to a winding of the magnetic assembly. The element layer includes an insulator, at least one power chip, a capacitor, a connector, and an upper surface and a lower surface opposite to each other. A laminated wiring is used inside the substrate, and the input capacitor is integrated, and the input capacitor is connected in parallel with the semiconductor switching devices electrically connected in series, thereby reducing the input loop and reducing the parasitic inductance in the input loop.

Abstract: The application discloses an N-phase TLVR integrated inductor, utilizes a main winding and an auxiliary winding with the same structure. Winding pins are arranged on the lower surface of the magnetic core, and coupling achieves a smaller dynamic inductance. An N-phase TLVR module is also provided, wherein a vertical switch device is embedded in a substrate of a bottom assembly. The integrated inductor and capacitor are disposed on the substrate's upper surface, and the inductor connects to the switch via wiring in the substrate. The substrate's lower surface, including an associated capacitor and metal column, is molded into a plastic package. A surface metal wiring layer on the package's lower surface connects to external components. This construction reduces module volume and improves dynamic performance.

Abstract: The application discloses a circuit topology and a control method for a high-power application of an input voltage to an output voltage with a high step-down ratio; the circuit topology has a low switching loss and a high conversion efficiency in a high-frequency switching occasion. The present application further provides a power conversion device using the circuit topology, which provides a device layout setting of the power conversion device and a winding mode of the transformer. Under the condition that high-power output is met, the volume of the power conversion device is further reduced, and the steady-state performance and dynamic performance of the conversion device are improved.

Abstract: A current sampling circuit is provided. The current sampling circuit includes a sampling unit provided with multiple sampling input terminals, a sampling reference terminal and at least one sampling output terminal. With a symmetric winding arrangement and a phase-offset configuration of control signals of the device, coupling voltage components sent to the current sampling circuit is self-counteracted. An amplification unit is further included in the current sampling circuit. Output signals of the current sampling circuit are calibrated by a calibration unit and compensated for temperature influences by a temperature compensation unit.

Abstract: The present application is directed to a power conversion device, which further reduces the thickness and volume of the power conversion device by optimizing the layout structure and winding method of the power conversion device. On the other hand, by optimizing the control/driving mode, the four control signals are used to realize low-loss driving control of the plurality of switches.

Abstract: The application discloses an immersed heat dissipation structure, a protective cover is mounted on the outer side of the power supply module, and an opening structure is provided on a side surface of the protective cover, so as to prevent metal particles in the cooling liquid from entering the power supply module, thereby improving the safety and reliability of the module. And, the coolant can flow inside the module through the opening structure of the protective cover, or the internal or surface parts of the gasification take-away module are transferred to the inside of the module by means of the substrate.

Abstract: A power conversion device is provided. By optimizing the winding manner of the high-voltage winding and the low-voltage winding and the layout of corresponding components, the output capability of the power conversion device is improved, and the loss on the energy transmission path is reduced; On the other hand, by means of the assembly structure of the first substrate and the second substrate, a winding is provided on the second substrate, and the magnetic core is assembled to the second substrate from the upper surface and the lower surface of the second substrate, respectively; a hole groove is provided on the first substrate, and the hole groove is used for accommodating an upper magnetic plate of the magnetic core assembly; thus, the volume of the power conversion device is further reduced, and the height difference of the main heating element is reduced, thereby achieving a low thermal resistance.

Abstract: The present application discloses an N-phase TLVR integrated inductor, a multi-phase module, an IPM having a small parasitic inductance, and a power supply system of a semiconductor chip. The integrated inductor and IPM constitute a multi-phase module and a power supply system of a semiconductor chip. The N-phase integrated inductor is provided with a copper sheet.

Abstract: The present application discloses a power supply module having high thermal conductivity and high reliability, and a vapor chamber, comprising a substrate, a thermally conductive material and a vapor chamber, wherein a thermally conductive material is provided between the vapor chamber and the substrate; the vapor chamber comprises a vapor chamber primary side region, a vapor chamber secondary side region, and a connecting region, the vapor chamber primary side region is disposed above the primary side portion of the substrate, the vapor chamber secondary side region is disposed above the secondary side portion of the substrate, and the vapor chamber primary side region and the vapor chamber secondary side region form an integral structure by means of the connecting region.

Abstract: The present invention is directed to a power supply module for immersion cooling, by providing uneven edges between the edge of the metal layer of the upper surface and the lower surface of the third substrate and the edge of the third substrate, the design of the spacing between adjacent metal layers and the design of the height of the gap between the third substrate and the first substrate or the second substrate, the faults and failures caused by the conductive particles in the cooling fluid are reduced. On the other hand, by dispensing glue at the key position between the first substrate and the third substrate and between the second substrate and the third substrate, the possibility that the conductive particles fluid into the power supply module is further reduced. The present invention further discloses several structures and manufacturing processes of the third substrate for immersion cooling.