Patents Assigned to Metascape, LLC.
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Patent number: 11306389Abstract: The invention is directed to an ion plasma deposition (IPD) method adapted to coat polymer surfaces with highly adherent antimicrobial films. A controlled ion plasma deposition (IPD) process is used to coat a metal or polymer with a selected metal/metal oxide. Exposing the coated surface to ultraviolet light significantly improves the antimicrobial properties of the deposited coatings.Type: GrantFiled: April 30, 2019Date of Patent: April 19, 2022Assignee: METASCAPE LLCInventors: Terrence S. Mcgrath, Deidre Sewell, Daniel M. Storey
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Publication number: 20140127391Abstract: The invention is directed to an ion plasma deposition (IPD) method adapted to coat polymer surfaces with highly adherent antimicrobial films. A controlled ion plasma deposition (IPD) process is used to coat a metal or polymer with a selected metal/metal oxide. Exposing the coated surface to ultraviolet light significantly improves the antimicrobial properties of the deposited coatings.Type: ApplicationFiled: January 7, 2014Publication date: May 8, 2014Applicant: METASCAPE, LLCInventors: TERRENCE S. MCGRATH, DEIDRE SEWELL, DANIEL M. STOREY
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Patent number: 8623446Abstract: The invention is directed to an ion plasma deposition (IPD) method adapted to coat polymer surfaces with highly adherent antimicrobial films. A controlled ion plasma deposition (IPD) process is used to coat a metal or polymer with a selected metal/metal oxide. Exposing the coated surface to ultraviolet light significantly improves the antimicrobial properties of the deposited coatings.Type: GrantFiled: October 3, 2006Date of Patent: January 7, 2014Assignee: Metascape LLCInventors: Terrence S. McGrath, Deidre Sewell, Daniel M. Storey
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Publication number: 20130053938Abstract: A molecular plasma deposition (MPD) method in combination with an atomic layer deposition (ALD) procedure is used to produce amorphous, nonconformal thin metal film coatings on a variety of substrates. The films are porous, mesh-like lattices with imperfections such as pinholes and pores, which are useful as scaffolds for cell attachment, controlled release of bioactive agents and protective coatings.Type: ApplicationFiled: August 1, 2012Publication date: February 28, 2013Applicant: METASCAPE LLCInventors: Tiffany E. Miller, Daniel M. Storey, Barbara S. Kitchell
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Patent number: 8158216Abstract: Vapor plasma deposition of titanium (Ti) metal onto a substrate forms a structured surface that exhibits enhanced cell attachment properties. Initially deposited round nanoparticulate surface structures develop tentacles with a spine or thorn-like appearance upon continued deposition under special conditions. The density and size of the formed spinulose particles can be controlled by timing the deposition intervals. A significant increase in osteoblast, fibroblast and endothelial cell attachment is observed on Ti spinulose surfaces compared to attachment on nanoparticulate surfaces lacking spinulous nanostructure.Type: GrantFiled: October 31, 2007Date of Patent: April 17, 2012Assignee: Metascape LLCInventors: Christina Kay Thomas, Luke J. Ryves, Daniel M. Storey
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Patent number: 8066854Abstract: The invention is directed to efficient methods for depositing highly adherent anti-microbial materials onto a wide range of surfaces. A controlled cathodic arc process is described, which results in enhanced adhesion of silver oxide to polymers and other surfaces, such as surfaces of medical devices. Deposition of anti-microbial materials directly onto the substrates is possible in a cost-effective manner that maintains high anti-microbial activity over several weeks when the coated devices are employed in vivo.Type: GrantFiled: April 19, 2006Date of Patent: November 29, 2011Assignee: Metascape LLCInventors: Daniel M. Storey, Deidre Sewell, Terrence S. McGrath, John H. Petersen
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Patent number: 7920369Abstract: An apparatus and method for initiation and control of a sustained metal plasma and nano plasma (macroparticulate) deposition methods for preparing modified metal coatings are provided. The plasma deposition process can be tightly controlled by virtue of a device that incorporates a plasma arc initiator component and an internal power supply that is capable of controlling dwell time on the target and the size range of particles ejected in the plasma arc.Type: GrantFiled: January 23, 2007Date of Patent: April 5, 2011Assignee: Metascape, LLC.Inventor: Daniel M. Storey