Abstract: A multifunctional assembly having a resistive element a conductive element in electrical communication with the resistive element, the conductive element defining at least one of a plurality of multifunctional zones of the resistive element, wherein the conductive element is configured to direct a flow of electricity across at least one of the plurality of multifunctional zones of the resistive element in a preselected manner.

Abstract: Systems and methods for in-situ monitoring of gearbox are provided. An example system includes a mounting plate coupled to a component within the gearbox and a transducer array having a plurality of piezoelectric transducers disposed thereon to ultrasonically obtain diagnostic information about one or more components in the gearbox. The plurality of piezoelectric transducers are in contact with a surface of one or more mechanical components within the gearbox. The system includes circuitry, at least a portion of which is mounted inside the gearbox, electrically couplable to the transducer array, the circuitry configured to direct an excitation signal to a selected piezoelectric transducer of the plurality of piezoelectric transducers, and direct a response received from one or more of the plurality of piezoelectric transducers in proximity to the selected piezoelectric transducer toward a processor programmed or configured to determine gearbox diagnostic information therefrom.

Abstract: A multifunctional assembly having a resistive element a conductive element in electrical communication with the resistive element, the conductive element defining at least one of a plurality of multifunctional zones of the resistive element, wherein the conductive element is configured to direct a flow of electricity across at least one of the plurality of multifunctional zones of the resistive element in a preselected manner.

Abstract: Exemplary embodiments are directed to instrumented fasteners and associated damage detection systems for detecting damage in an assembled structure secured together by at least one instrumented fastener. The instrumented fastener forms a transducer assembly for detecting damage in the assembled structure. The fastener can include a cavity disposed at one end of the fastener. The transducer assembly includes an electromechanical unit at least partially inserted into and mechanically coupled within the cavity of the fastener. The electromechanical unit can include a piezoelectric element.

Abstract: Exemplary embodiments are directed to thermally driven actuator systems including a thermally driven element and one or more heating elements coupled to and in thermal contact with the thermally driven element. The thermally driven element can be capable of being selectively reconfigured in shape based on a thermal strain or temperature driven phase change. The one or more heating elements can be configured to selectively and independently apply heat to one or more of a plurality of different regions of the thermally driven element to selectively raise a temperature or temperatures of the selected region or regions of the thermally driven element to selectively reconfigure the shape of the thermally driven element.

Abstract: Devices and methods described herein provide electrode pair access from a single side of a device by using one or more via holes through the device. The via hole can pass through or near the center of the device. By creating a conductive path through the via hole of the device, devices and methods of the present disclosure advantageously provide access to a pair of electrodes, each of which contacts a different side of a device layer, on a single side of the device while enabling a greater active device area than is possible using conventional techniques. In addition, the central location of the via hole provides favorable mechanical properties by avoiding radial constriction of the device layers in applications such as piezoelectric devices.

Abstract: Various applications for structured CNT-engineered materials are disclosed herein. In one application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of providing its own structural feedback. In another application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of generating heat. In yet another application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of functioning as an antenna, for example, for receiving, transmitting, absorbing and/or dissipating a signal. In still another application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of serving as a conduit for thermal or electrical energy.

Abstract: Various applications for structured CNT-engineered materials are disclosed herein. In one application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of providing its own structural feedback. In another application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of generating heat. In yet another application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of functioning as an antenna, for example, for receiving, transmitting, absorbing and/or dissipating a signal. In still another application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of serving as a conduit for thermal or electrical energy.

Abstract: Systems and methods of coupling digitizing sensors to a structure are disclosed. A particular system includes a digitizing sensor node. The system further includes a bus including a plurality of conductive elements applied to a substrate. A first conductive element of the bus is coupled to the digitizing sensor node using a direct-write technique.

Abstract: Various applications for structured CNT-engineered materials are disclosed herein. In one application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of providing its own structural feedback. In another application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of generating heat. In yet another application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of functioning as an antenna, for example, for receiving, transmitting, absorbing and/or dissipating a signal. In still another application, systems are disclosed, wherein a structured CNT-engineered material forms at least part of an object capable of serving as a conduit for thermal or electrical energy.

Abstract: A device for use in detecting an event in a structure includes a sensor encapsulation, the encapsulation containing a sensor, an actuator positioned substantially in-plane to the sensor within the housing and a printed circuit board in communication with at least one of the sensor and the actuator. The printed circuit board includes a microprocessor constructed and arranged to collect data from at least one of the sensor and the actuator, a signal generator constructed and arranged to provide excitation to at least one of the sensor and the actuator, and an amplifier to condition the excitation.

Abstract: A device for use in detecting an event in a structure includes a sensor encapsulation, the encapsulation containing a sensor, an actuator positioned substantially in-plane to the sensor within the housing and a printed circuit board in communication with at least one of the sensor and the actuator. The printed circuit board includes a microprocessor constructed and arranged to collect data from at least one of the sensor and the actuator, a signal generator constructed and arranged to provide excitation to at least one of the sensor and the actuator, and an amplifier to condition the excitation.

Abstract: A method of detecting an event in a structure using a device having sensors and at least one actuator includes sending a signal from the at least one actuator encapsulated in the device, returning a reflected wave signal from the event to each of the sensors in the device, determining a respective duration of time for which the signal travels from the event to each of the sensors, and calculating a location of the event by using differences in the respective durations of time for which the signal travels from the event to each of the sensors to determine an angle and a distance at which the event is positioned.

Abstract: A device for use in detecting structural damage includes at least one piezoelectric wafer that has a sensor, and an actuator in-plane with the sensor. At least one of the sensor and the actuator at least partially surrounds the other of the sensor and the actuator such that the piezoelectric wafer provides radial detection of structural occurrences in a material.

Abstract: A device for use in detecting an event in a structure includes a sensor encapsulation, the encapsulation containing a sensor, an actuator positioned substantially in-plane to the sensor within the housing and a printed circuit board in communication with at least one of the sensor and the actuator. The printed circuit board includes a microprocessor constructed and arranged to collect data from at least one of the sensor and the actuator, a signal generator constructed and arranged to provide excitation to at least one of the sensor and the actuator, and an amplifier to condition the excitation.