Abstract: A two part device is used in leveling and spacing tiles. The device includes two parts, a rotatable portion called a knob-cam and a fixed portion called hook-base. The hook-base includes ribs for spacing and separating tiles, and a neck portion extending through a slot opening in the knob-cam. In use, the hook-base portion is set down and tiles are laid down and spaced by the ribs of the base portion. The neck portion extends upwardly above the tiles, and is adapted to be broken away upon application of sufficient upward force or sideways force. The knob-cam includes two diametral opposed frontal action cam surfaces that engage portions of the hook when the knob-cam is rotated. The knob-cam is rotated until the tiles are secured between the knob-cam and the hook-base. This clamps the corners or edges of the tiles, making coplanar upper surfaces.
Abstract: A method and apparatus for correcting phase shift defects in a photomask is provided by scanning the photomask for the defect and determining locations of at least one defect. Following the determination of the location of a defect, the defect is three-dimensionally analyzed producing three-dimensional results. Utilizing the three-dimensional results, a focus ion beam (FIB) is directed onto the defect to eliminate the defect. The FIB is controlled by an etch map which is generated based on the three-dimensional results. To provide further precision to the repairing of the photomask, test patterns of the FIB are generated and three-dimensionally analyzed. The three-dimensional test pattern results are further utilized in generating the etch map to provide greater control to the FIB.
Abstract: A method and apparatus for correcting phase shift defects in a photomask is provided by scanning the photomask for the defect and determining locations of at least one defect. Following the determination of the location of a defect, the defect is three-dimensionally analyzed producing three-dimensional results. Utilizing the three-dimensional results, a focus ion beam (FIB) is directed onto the defect to eliminate the defect. The FIB is controlled by an etch map which is generated based on the three-dimensional results. To provide further precision to the repairing of the photomask, test patterns of the FIB are generated and three-dimensionally analyzed. The three-dimensional test pattern results are further utilized in generating the etch map to provide greater control to the FIB.