Abstract: In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

Abstract: In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.

Abstract: A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis. The at least semi-flexible elongate member is bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of at least 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of at least 1 inch. The top layer is pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared.

Abstract: In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.

Abstract: A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis. The at least semi-flexible elongate member is bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of at least 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of at least 1 inch. The top layer is pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared.

Abstract: In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

Abstract: In some embodiments, a circuit board interconnect may include one or more of the following features: (a) a first circuit board having a plated through hole within a metal pad on the circuit board, the through hole providing a passage for solder to connect the first circuit board to a second circuit board, (b) a second circuit board having a metal pad able to couple to the first circuit board in an overlapping fashion when solder is passed through the plated through hole, and (c) a non-conductive solder repelling material on a surface of one circuit board.

Abstract: In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.