Abstract: A contacting arrangement for a circuit board support assembly of an electroplate installation has first and second spaced-apart bar members connected together by spacers. The first bar member carries contact clamps from which first contact members project. Spring members project from the second bar member towards the first bar member, each of the spring members being provided with at least one second contact member. The first and second contact members co-operate to hold a board therebetween, associated pairs of contact members being urged towards each other at contact surfaces thereof by way of the associated spring member.

Abstract: A holding apparatus for articles to be electroplated has upstanding bar elements with contact members for holding and contacting the articles which are supplied to the holding apparatus from the front thereof. Provided at the rear of the holding apparatus and spaced from the bar elements are upright columns along which elongate transverse elements are displaceable and can be arrested thereon. The transverse elements carry support devices such as piston-cylinder units with support members for the articles, so that the support members can be positioned in a plane in which adjacent bar elements extend, for supporting the articles.