Abstract: A melt-quenched thin-film alloy indicated by the alloy composition formulaR.sub.X Fe.sub.100-(X+Y+Z+W) Co.sub.W B.sub.Y V.sub.Zwherein: R represents Nd alone or a composite rare earth element containing at least 50 atomic % of Nd, where the atomic precentages being 9.ltoreq.X.ltoreq.12, 6.ltoreq.Y.ltoreq.10, 0.5.ltoreq.Z.ltoreq.3 and 5.ltoreq.W.ltoreq.16; and a process for producing a melt-quenched thin-film of an alloy for a bonded magnet comprising injecting a melt of an alloy indicated by the alloy composition formulaR.sub.X Fe.sub.100-(X+Y+Z+W) CO.sub.W B.sub.Y V.sub.Z(wherein: R represents Nd alone or a composite rate earth element containing at least 50 atomic % of Nd, where the atomic percentages being 9.ltoreq.X.ltoreq.12, 6.ltoreq.Y.ltoreq.10, 0.5.ltoreq.Z.ltoreq.3 and 5.ltoreq.W.ltoreq.16) via the pressure of an inert gas on the surface of a rolling roll for cooling, and then quenching said melt.

Abstract: An electric connector for electrically connecting between an electric element and conductors on a printed circuit board comprises a plastic main body and a plurality of conductor members penetrating the main body. Each conductor members has a connecting portion for connecting to the electric element and a terminal portion for connecting to one conductor on the printed circuit board. Each terminal portion of the conductor members has a first face which contacts with one conductor on the printed circuit board when the electric connector is arranged on the printed circuit board so that each connecting portion of the conductor members extends parallel to the printed circuit board and a second face which contacts with one conductor on the printed circuit board when the electric connector is arranged on the printed circuit board so that each connecting portion of the conductor members extends perpendicularly to the printed circuit board.