Patents Assigned to MGK Insulators, Ltd.
  • Honeycomb structure and method for producing same
    Patent number: 7947103
    Abstract: Disclosed is a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass % of a layered clay mineral. Also disclosed are a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass % of an organic binder, and a honeycomb structure which is bonded with a bonding material having a Casson yield value of 6 Pa or more. Further disclosed is a method for producing such a honeycomb structure.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: May 24, 2011
    Assignee: MGK Insulators, Ltd.
    Inventors: Naoshi Masukawa, Atsushi Watanabe, Shuichi Ichikawa