Abstract: There is provided a method for applying thermosetting tape on contoured resilient surfaces off an object which comprises biasing selected section(s) of the resilient member to minimize tape and object distortion. There is also provided a tape laying apparatus configured to enable the optimization of automatic tape application on resilient contoured surfaces and minimize tape and object distortion.
Type:
Grant
Filed:
September 20, 2016
Date of Patent:
February 18, 2020
Assignee:
MI INTEGRATION S.E.N.C.
Inventors:
Yves Martin, Claude Houle, Yannick Longpré, Nicolas Nadeau
Abstract: There is provided a method for applying thermosetting tape on contoured resilient surfaces off an object which comprises biasing selected section(s) of the resilient member to minimize tape and object distortion. There is also provided a tape laying apparatus configured to enable the optimization of automatic tape application on resilient contoured surfaces and minimize tape and object distortion.
Type:
Application
Filed:
September 20, 2016
Publication date:
September 6, 2018
Applicant:
MI INTEGRATION S.E.N.C.
Inventors:
Yves MARTIN, Claude HOULE, Yannick LONGPRÉ, Nicolas NADEAU