Patents Assigned to MI INTEGRATION S.E.N.C.
  • Patent number: 10562242
    Abstract: There is provided a method for applying thermosetting tape on contoured resilient surfaces off an object which comprises biasing selected section(s) of the resilient member to minimize tape and object distortion. There is also provided a tape laying apparatus configured to enable the optimization of automatic tape application on resilient contoured surfaces and minimize tape and object distortion.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: February 18, 2020
    Assignee: MI INTEGRATION S.E.N.C.
    Inventors: Yves Martin, Claude Houle, Yannick Longpré, Nicolas Nadeau
  • Publication number: 20180250892
    Abstract: There is provided a method for applying thermosetting tape on contoured resilient surfaces off an object which comprises biasing selected section(s) of the resilient member to minimize tape and object distortion. There is also provided a tape laying apparatus configured to enable the optimization of automatic tape application on resilient contoured surfaces and minimize tape and object distortion.
    Type: Application
    Filed: September 20, 2016
    Publication date: September 6, 2018
    Applicant: MI INTEGRATION S.E.N.C.
    Inventors: Yves MARTIN, Claude HOULE, Yannick LONGPRÉ, Nicolas NADEAU