Abstract: A method of fabricating an array substrate is provided. The method includes forming a plurality of first thin film transistors on a base substrate, a respective one of the plurality of first thin film transistors formed to include a first active layer, a first gate electrode, a first source electrode and a first drain electrode; and forming a plurality of second thin film transistors on the base substrate, a respective one of the plurality of second thin film transistors formed to include a second active layer, a second gate electrode, a second source electrode and a second drain electrode. Forming the first source electrode includes forming a first source sub-layer and forming a second source sub-layer in separate patterning steps. Forming the first drain electrode includes forming a first drain sub-layer and forming a second drain sub-layer in separate patterning steps.

Abstract: A touch substrate, a touch device and a touch detection method are provided. The touch substrate includes: a base substrate, including a touch region and a trace region surrounding the touch region; multiple sensing electrodes arranged in the touch region; and multiple sensing electrode traces arranged in the trace region and connected to the multiple sensing electrodes respectively. The sensing electrodes includes first sensing electrodes and second sensing electrodes, each first sensing electrode is connected at a first side of the touch region to a sensing electrode trace, and each second sensing electrode is connected at a second side of the touch region opposite to the first side to a sensing electrode trace. In this disclosure, sensing electrodes are connected at two opposite sides of the touch region to the sensing electrode traces, therefore, two sensing electrodes may be scanned each time, shortening a scanning period of the sensing electrodes.

Abstract: A via hole structure includes: a first conductive layer, an interlayer insulating layer, and a second conductive layer that are sequentially arranged, wherein the interlayer insulating layer is provided with a via hole, the second conductive layer is overlapped with the first conductive layer by the via hole, and at least part of a surface, in contact with the second conductive layer, of the interlayer insulating layer is uneven.

Abstract: Provided are a drive method and drive circuit for an organic light-emitting diode panel and a display device. The method is applied to an organic light-emitting diode panel, which includes a light-emitting layer, and a first light-emitting control electrode layer and a touch electrode layer sequentially on the light-emitting layer. The first light-emitting control electrode layer and the touch electrode layer are insulated from each other. The method includes: outputting a display voltage to the first light-emitting control electrode layer at a display stage and outputting a shielding voltage to the first light-emitting control electrode layer at a touch stage.

Abstract: At least one embodiment of the present disclosure provides a display substrate motherboard, a display substrate, a fabrication method thereof and a display device. The display substrate motherboard includes at least one display substrate unit, the display substrate unit includes a display region, a bonding region and a detection region, the bonding region is located on a side of the display region and the detection region is located on a side of the display region different from the bonding region and configured to detect the display substrate unit.