Abstract: A method of manufacturing improved thin-film solar cells entirely by sputtering includes a high efficiency back contact/reflecting multi-layer containing at least one barrier layer consisting of a transition metal nitride. A copper indium gallium diselenide (Cu(InXGa1-X)Se2) absorber layer (X ranging from 1 to approximately 0.7) is co-sputtered from specially prepared electrically conductive targets using dual cylindrical rotary magnetron technology. The band gap of the absorber layer can be graded by varying the gallium content, and by replacing the gallium partially or totally with aluminum. Alternately the absorber layer is reactively sputtered from metal alloy targets in the presence of hydrogen selenide gas. RF sputtering is used to deposit a non-cadmium containing window layer of ZnS. The top transparent electrode is reactively sputtered aluminum doped ZnO. A unique modular vacuum roll-to-roll sputtering machine is described.

Abstract: Provided are photovoltaic module assemblies configured for improved installation. The assemblies include frameless photovoltaic modules and retainers for supporting the modules on mounting structures. The retainers support the modules at least during cure of adhesive materials provided between the modules and the mounting structures. Once cured, the adhesive materials provide permanent support to the modules. The retainers may interlock with the mounting structures during installation or be integral components of the structures. In certain embodiments, retainers are used to control a gap between the modules and mounting structures. Retainers may be removable and collected after installation is completed. Alternatively, retainers may remain as parts of assemblies at least during some initial period. Retainers may be made from various degradable materials, such as biodegradable plastics, UV degradable plastics, and/or water soluble materials.

Abstract: Provided are novel building integrable photovoltaic (BIP) modules and methods of installing thereof. A module may include a photovoltaic insert having at least one photovoltaic cell, a channel provided on one edge of the insert, and an extension provided on the opposite edge. The extension is configured to fit snugly into a corresponding channel of an adjacent module during installation. The two modules may have the same design and form a photovoltaic array, which may involve interconnecting with additional modules. The interconnection prevents lifting of one module with respect another. Therefore, each module needs to be attached to a building structure only along one edge, while the opposite edge is supported by another module. Attachment to the building structure may be in a concealed area of the module, such as a moisture flap, to prevent exposed though holes. This configuration improves moisture sealing properties of the resulting array.

Abstract: A method of manufacturing improved thin-film solar cells entirely by sputtering includes a high efficiency back contact/reflecting multi-layer containing at least one barrier layer consisting of a transition metal nitride. A copper indium gallium diselenide (Cu(InXGa1-X)Se2) absorber layer (X ranging from 1 to approximately 0.7) is co-sputtered from specially prepared electrically conductive targets using dual cylindrical rotary magnetron technology. The band gap of the absorber layer can be graded by varying the gallium content, and by replacing the gallium partially or totally with aluminum. Alternately the absorber layer is reactively sputtered from metal alloy targets in the presence of hydrogen selenide gas. RF sputtering is used to deposit a non-cadmium containing window layer of ZnS. The top transparent electrode is reactively sputtered aluminum doped ZnO. A unique modular vacuum roll-to-roll sputtering machine is described.

Abstract: A photovoltaic device includes at least one photovoltaic cell, a flexible glass layer formed over the at least one photovoltaic cell, and a transparent planarizing hardcoat formed on the glass layer. The planarizing hardcoat may be in compressive stress and the glass layer may be in tension.

Abstract: A photovoltaic device includes at least one photovoltaic cell, a flexible glass layer formed over the at least one photovoltaic cell and a transparent and abrasion resistant film which includes an organic-inorganic hybrid material formed over the glass layer.

Abstract: Provided are electrical routing structures for installing on buildings and for interconnecting adjacent rows of building integrable photovoltaic (BIPV) modules at the ends of these rows. The electrical routing structures may be also used for sealing interfaces with other building components, such as asphalt shingles. An electrical routing structure may include a base, top flap, side flap, and one or two connectors. After the structure is installed, the base is aligned with photovoltaic portions of BIPV modules in one row and bridges a gap between photovoltaic portions of BIPV modules in two adjacent rows. The connectors may be used to interconnect BIPV modules positioned at the ends of two adjacent rows.

Abstract: A sputtering target has a cylindrical backing tube having two edges and a sidewall comprising a middle portion located between two end portions. The sputtering material is on the backing tube. The sputtering material does not cover at least one end portion of the backing tube. The sputtering target also has a feature which prevents or reduces at least one of chalcogen buildup and arcing at the at least one end portion of the backing tube not covered by the sputtering material.

Abstract: A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.

Abstract: Provided herein are methods of incorporating additives into thin-film solar cell substrates and back contacts. In certain embodiments, sodium is incorporated into a substrate or a back contact of a thin-film photovoltaic stack where it can diffuse into a CIGS or other absorber layer to improve efficiency and/or growth of the layer. The methods involve laser treating the substrate or back contact in the presence of a sodium (or sodium-containing) solid or vapor to thereby incorporate sodium into the surface of the substrate or back contact. In certain embodiments, the surface is simultaneously smoothed.

Abstract: Provided are novel junction boxes for solar modules. The junction boxes or J-boxes can be rotated or otherwise moved to change the module's electrical connection state. According to various embodiments, the J-boxes are movable between two or more orientations each associated with an electrical connection configuration. In particular embodiments, the configurations include two or more of an on position, an off position, an on series configuration, an on series-parallel configuration, and a bypass configuration. A J-box according to certain embodiments includes a replaceable insert. The insert may include one or more bypass diodes, an inverter or a DC/DC converter.

Abstract: Provided herein are methods of polishing, cleaning and texturing back contacts of thin-film solar cells. According to various embodiments, the methods involve irradiating sites on the back contact with laser beams to remove contaminants and/or smooth the surface of the back contact. The back contact, e.g., a molybdenum, copper, or niobium thin-film, is smoothed prior to deposition of the absorber and other thin-films of the photovoltaic stack. In certain embodiments, laser polishing of the back contact is used to enhance the diffusion barrier characteristics of the back contact layer, with all or a surface layer of the back contact becoming essentially amorphous. In certain embodiments, the adhesion of the absorber layer is enhanced by the textured back contact and by the presence of the amorphous metal at the deposition surface.

Abstract: Provided herein are methods of polishing and texturing surfaces thin-film photovoltaic cell substrates. The methods involve laser irradiation of a surface having a high frequency roughness in an area of 5-200 microns to form a shallow and rapidly expanding melt pool, followed by rapid cooling of the material surface. The minimization of surface tension causes the surface to re-solidify in a locally smooth surface. the high frequency roughness drops over the surface with a lower frequency bump or texture pattern remaining from the re-solidification.

Abstract: Provided are novel photovoltaic cell alignment apparatuses and methods for fabricating photovoltaic module sub-assemblies that include multiple aligned photovoltaic cells. The apparatuses and methods provide high-speed precise alignment of the cells with respect to each other and other components of a photovoltaic module. In certain embodiments, a set of photovoltaic cells is first aligned on an alignment plate of an alignment apparatus and then transferred to a sealing sheet of the module such that the respective alignments of the cells are maintained during transfer. The alignment plate may include multiple cell receiving areas that have corresponding alignment edges. Aligning photovoltaic cells on this plate may involve forcing the cells against the alignment edges and/or moving the cells in the receiving areas in a direction parallel to the alignment edges.

Abstract: Provided are electrical routing structures for installing on buildings and for interconnecting adjacent rows of building integrable photovoltaic (BIPV) modules at the ends of these rows. The electrical routing structures may be also used for sealing interfaces with other building components, such as asphalt shingles. An electrical routing structure may include a base, top flap, side flap, and one or two connectors. After the structure is installed, the base is aligned with photovoltaic portions of BIPV modules in one row and bridges a gap between photovoltaic portions of BIPV modules in two adjacent rows. The connectors may be used to interconnect BIPV modules positioned at the ends of two adjacent rows.

Abstract: Provided are multi-module inverters and/or converters for connecting to a set of building integrable photovoltaic (BIPV) modules that are interconnected in series and arranged into photovoltaic arrays on building structures. Outputs from multiple multi-module inverters and/or converters in one array may be combined using parallel connections and then connected to an electrical grid, standalone electrical network, or central inverter. Each set is connected to a different multi-module inverter and/or converter and may have a variable number of BIPV modules. A multi-module inverter and/or converter may be positioned within or integrated into one of the BIPV modules or attached to a building structure supporting the array. In certain embodiments, a multi-module inverter and/or converter is installed in a ventilation channel on the back side of a module. A multi-module inverter and/or converter may be also integrated into an electrical routing structure connected to one of the BIPV modules.

Abstract: A method of manufacturing a solar cell including providing a substrate, depositing a first electrode over the substrate and depositing at least one p-type semiconductor absorber layer over the first electrode. The p-type semiconductor absorber layer comprises a copper indium selenide (CIS) based alloy material. The method also includes depositing by reactive sputtering an n-type In-VI semiconductor layer over the at least one p-type semiconductor absorber layer and depositing a second electrode over the n-type In-VI semiconductor layer.

Abstract: A magnetron include a center plurality of magnets and an outer plurality of magnets arranged around the center plurality of magnets in a shape of two long sections and two shorter turnaround sections. The outer plurality of magnets are configured with at least one region of weaker magnetic field strength in at least one of the two long sections and adjacent to one of the two turnaround sections.

Abstract: Provided are novel building integrable photovoltaic (BIPV) modules having integrated jumpers for interconnecting similar modules in adjacent rows. An integrated jumper is provided on a back side of the photovoltaic portion of the module and includes at least two interconnected jumper contact points. The module also has two connectors provided on the front side of its flap portion. Each connector has at least one connector contact point connected to one or more photovoltaic cells of the module. When a module is positioned over flap portions of two other modules previously installed in an adjacent row, the two jumper contact points on the back side of this new module make electrical connections to the two connector contact points on the front side of the installed modules. In turn, these connections interconnect the photovoltaic cells of the two modules without any need for additional connectors or operations.

Abstract: Provided are novel building integrable photovoltaic (BIPV) structures having multiple photovoltaic portions offset with respect to each other along their lengths. An offset direction can correspond to the length of a row of installed BIPV structures. In some embodiments, a BIPV structure may include three offset photovoltaic portions and three corresponding flap portions for extending under photovoltaic portions of adjacent structures and sealing interfaces between installed structures. The novel BIPV structures can facilitate installation, while providing the flexibility to avoid obstacles. Provided also are novel BIM/assemblies having multi-conductor return lines extending through the assemblies. A BIPV assembly having a multi-conductor return line may include a return line for the assembly itself, and one or more return lines for other assemblies.