Patents Assigned to ?mic AB
  • Patent number: 9347931
    Abstract: The present invention is directed to a lateral flow assay device for the monitoring and measuring of coagulation and method thereof. Ideally, the invention is directed to a lateral capillary flow device for the monitoring and/or measurement of coagulation in a liquid sample wherein the device comprises a non-porous substrate with a zone for receiving a sample and a defined flow path zone wherein a clotting agent is deposited on at least part of the defined flow path zone to accelerate the coagulation of the liquid sample, enable the formation of an evenly distributed clot along the defined flow path zone and to result in the change in flow rate or cessation of flow of the liquid sample along the defined flow path zone.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: May 24, 2016
    Assignees: DUBLIN CITY UNIVERSITY, ÅMIC AB
    Inventors: Anthony Joseph Killard, Magdalena Maria Dudek, Brian MacCraith, Ib Mendel-Hartvig, Ove Öhman
  • Patent number: 7182890
    Abstract: The invention relates to a matrix suitable for use in the replication of a plastic element having a positive microstructure, comprising a first wear-resistant layer that is supported by a carrier element, wherein the matrix comprises a heating means for supplying electrical heat energy through the wear-resistant layer or carrier element. The invention further relates to a plastic element producing machine and a method for the manufacture of a plastic element having a surface with a positive microstructure.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: February 27, 2007
    Assignees: Gyros Patent AB, Åmic AB
    Inventors: Per Ove Öhman, Lars Rune Lundbladh
  • Patent number: 6372542
    Abstract: The present invention relates to a method of producing an electric, electronic, electromechanical and/or mechanical component (12), where the component substrate is given a three-dimensional structure (3″) or configuration, and where said substrate is adapted for further treatment or processing to form the component (12). The substrate is formed by shaping said substrate against a die or mold, such as by molding, pressing, extruding or embossing said substrate, wherewith the precision necessary with respect to said component in the three-dimensional structure is achieved by means of a micromechanical working process when producing the die or mold.
    Type: Grant
    Filed: October 19, 2000
    Date of Patent: April 16, 2002
    Assignee: Åmic AB
    Inventors: Hans Göran Evald Martin, Per Ove Öhman