Abstract: A method and apparatus is provided for sorting semiconductor devices for processing where the semiconductor devices have been singulated from a strip containing a plurality of semiconductor devices and where an electronic strip map has been created corresponding to the strip of semiconductor devices and the electronic strip map contains address and quality information related to each individual singulated semiconductor device. The method includes the steps of moving a pickup device to a location adjacent the singulated semiconductor devices and selectively picking up a first plurality of singulated semiconductor devices based on the electronic strip map information related to the singulated semiconductor devices and moving the semiconductor devices that have been picked up to a predetermined location based on the electronic strip map information related to the specific semiconductor devices that have been picked up and unloading the first plurality of semiconductor devices at the predetermined location.

Abstract: A method and apparatus is provided for sorting semiconductor devices for processing where the semiconductor devices have been singulated from a strip containing a plurality of semiconductor devices and where an electronic strip map has been created corresponding to the strip of semiconductor devices and the electronic strip map contains address and quality information related to each individual singulated semiconductor device. The method includes the steps of moving a pickup device to a location adjacent the singulated semiconductor devices and selectively picking up a first plurality of singulated semiconductor devices based on the electronic strip map information related to the singulated semiconductor devices and moving the semiconductor devices that have been picked up to a predetermined location based on the electronic strip map information related to the specific semiconductor devices that have been picked up and unloading the first plurality of semiconductor devices at the predetermined location.

Abstract: An apparatus for thermally conditioning a semiconductor unit is provided which includes a surface plate for receiving the semiconductor unit thereon which is connected to a thermoelectric device and a closed loop heat exchanger. At least one temperature sensor is disposed adjacent the surface plate for sensing the temperature of the surface plate. The thermoelectric device has first and second sides with the first side disposed against the surface plate. The closed loop heat exchanger is coupled to the second side of the thermoelectric device. The closed loop heat exchanger includes a chamber or cavity having an inlet and an outlet with the chamber disposed adjacent the second side of the thermoelectric device. The closed loop heat exchanger further includes conduit connected to the inlet and outlet of the chamber and a heat transfer unit connected to the conduit opposite the chamber.

Abstract: A system for calibrating the input tray of an integrated circuit handling device for temperature. The system includes a plurality of fixed sensors mounted at locations along the input tray of the handling device. The fixed sensors serve to sense temperatures within defined zones corresponding to the locations at which the fixed sensors are positioned. Various heaters are also included, and these heaters adjust temperature within the defined zones in response to temperature readings sensed by the fixed sensors. Each of a plurality of thermocouple sensors is received within an integrated circuit body. Such an IC body-carried thermocouple sensor is positionable at a location along the input tray of the handling device at a location closely proximate the location of a fixed sensor. Such thermocouple sensors serve to sense the actual temperature to which an IC passing along the input tray would be exposed as it passes through a zone defined by a corresponding fixed sensor.

Abstract: Apparatus (10) for centering an integrated circuit device (12) along X and Y axes (95, 97) with respect to a Z axis (39). First and second jaw pairs (98, 100), are actuated so that corresponding jaws of each pair are, at all times, disposed along their respective axis at equal distances from the Z axis (39). Corresponding jaws of each pair (98, 100) are, concurrently, moved toward and away from the Z axis, therefore. In a preferred embodiment, actuation is effected by means of linear extender rods, (70, 72) which, in turn, in effect rotation of discs (26, 28) and their corresponding turnstiles (106, 114). Turnstile (106, 114) rotation, in turn, effects linear movement of track riders (84, 86) to which the jaw pairs, (98, 100) are mounted.

Abstract: A device for precisely aligning a shuttle (28) in registration with a track from which the shuttle (28) is to receive an integrated circuit electronic device or into which the shuttle (28) is to deposit such a device. The device includes a shaft (42) disposed for rotation about an axis generally parallel to the axis along which the shuttle (28) moves. Pins (44), one corresponding to each of the tracks from which an integrated circuit electronic device is received within the shuttle (28) and the track or tracks into which such a device is to be deposited by the shuttle (28), extend generally radially from the shaft (42). The shuttle (28) carries a notch plate (54) having an open-sided notch (60) formed therein. The notch is defined by a pair of wall edges of a pair of fingers (56) formed in the plate (54).

Abstract: An apparatus for decoupling one contact (40) of an integrated circuit device (12) from a primary power source provided by a tester. The apparatus includes a rack mount (58) applied over each of two pluralities of probe fingers (16) which, together with other structure, provide electronic communication between the contacts (40) of the device (12) being tested and the primary power soruce. Each of the mounts (58) has a plurality of recesses (60) formed therein for receipt of various chip capacitors (92) and shorting elements (94). The recesses (60) pass fully through their respective rack mounts (58), and a contact strip (78) is positioned in an overlying relationship to a corresponding rack mount (58) to secure the chip capacitors (92) and shorting elements (94), selectively inserted into the various recesses (60), in operative electronic engagement with probe fingers (16) corresponding to the recesses (60) in which the various capacitors (92) and shorting elements (94) are received.

Abstract: Apparatus is disclosed for optically detecting the position of an edge of a workpiece (such as an IC lead tip) in a sensing plane, involving the emission of electromagnetic energy from a known source region in the sensing plane such as to cause the edge to create a shadow having a penumbra in the sensing plane. Two detectors determine the amount of energy which reach two known detection regions in the sensing plane and wholly within the penumbra. The amount of energy detected by one detector determines a first curve in the sensing plane on which the edge must lie, and the amount of energy detected by the other determines a second such curve. The intersection of these two curves fully determines the position of the edge in the sensing plane. Preferably, the source region and both detector regions are all essentially line segments oriented parallel to a z-axis, the two detection regions being disposed axially but spaced from each other.

Abstract: The invention of the present document is an improved disc singulator (10) for use in singulating and delivering to a test site (12) an integrated circuit device (14) to be tested by a tester mechanism. The singulator (10) includes structure to positively hold the device (14) within slots (64) formed in the periphery (52) of the disc (10) as it is rotated. A main body portion (16) of the device (14) is, thereby, held so that a plane defined by the main body (16) is oriented generally orthogonal to a plane defined by the disc (10). Additionally, the device (14) is held at an appropriate radial location with respect to the disc (14) so that, as the disc (10) rotates the device (14) carried thereby through a slit (40) in a printed circuit board (36) at the test site (12), contacts (26) of the device (14) will engage corresponding probes (38) at the test site (12).

Abstract: A shuttle-actuated singulation apparatus (10) for use in handling integrated circuit devices (16). A shuttle (39), acting to isolate or singulate an individual integrated circuit device (16) for transfer to a test apparatus, is included. A shuttle assembly (30) is carried by a splined shaft (34) for rotational movement of shuttle (39) carried thereby. The assembly (30), additionally, is moved laterally by means of a drive cable (36). Rotation of a shuttle barrel (32) and associated upward pivoting of shuttle projectiles (42) carried by barrel (32) effects engagement of a bell crank (70) which, in turn, engages a belt drive mount (82) carrying a drive belt (80). The drive belt (80), thereafter, is engaged with an integrated circuit device (16) to impel the device (16) out of a track (12) in which it is received.

Abstract: A soft-handling drop shuttle for use in an integrated circuit device handler. The invention includes a shuttle assembly (10) which pivots from a first position, in registration with an intake chute (36), and a second position, in registration with a discharge chute (50). The shuttle assembly (10) includes a shuttle lower jaw (14) for supporting an integrated circuit device (38) during its transfer, and a shuttle upper jaw (22), which is pivotally attached by an upper jaw pivot shaft (32) to the shuttle assembly (10). Upper jaw (22) retains the integrated circuit device (38) within the shuttle assembly (10) during the movement of the shuttle. The shuttle upper jaw (22) includes a stop portion (54) and an associated leaf spring (28) for retaining and clamping the integrated circuit device (38) within the shuttle assembly (10). Interchangeable shuttle lower jaws (14, 14') enable adaptation of assembly (10) to accommodate integrated circuit devices (38) of varying sizes and types.

Abstract: An impedance matching block (16, 42, 92) for multi-pin connectors (10, 36, 104). A male connector member (12, 38) carrying signal male pins (18, 20) is mated to a female connector member (14) having signal female pins (24, 26), the male pins (18, 20) being received in corresponding female pins (24, 26). The impedance matching block (16) is interposed between male connector member (12) and female connector member (14). The block (16) is provided with impedance matching holes (32, 34) through each of which holes (32, 34) one paired combination of male and female pins (18, 20, 24, 26) passes coaxially.

Abstract: The device of this invention is an integrated circuit singulator apparatus comprised of several arm assemblies (14, 18, 34) which act in concert to isolate or singulate an individual integrated circuit for testing of the accuracy of the circuits therein. This integrated circuit handler can accommodate integrated circuits of varying dimensions. The various arm assemblies (14, 18, 34) act to control movement of the integrated circuit devices on a track (12) without damage occurring to the integrated circuit devices.

Abstract: The present invention is a device for receiving an integrated circuit (10) presented at a pick-up station (22), transferring the integrated circuit (10) laterally to a spaced output chute (84, 90), and depositing the integrated circuit (10) into said chute (84, 90). The device includes a shuttle (24) mounted for pivotal and lateral movement on a shaft (40). The shuttle (24) is driven by an angled arm (62) mounted pivotally beneath the shuttle (24). The arm (62) is pivoted about an axis by means of a motor (56) and a linking shaft (52). A housing (76) carried by the arm (62) at an end thereof opposite the end by which it is pivoted encases and holds therein a spherical bearing (78) which is free to swivel within the housing (76) for rotation about three mutually perpendicular axes. The bearing (78) has an aperture (80) formed therethrough. The aperture (80) accommodates a rod (72) carried by the shuttle (24) at its underside.

Abstract: A vacuum head (10) for pick-up and placement of integrated circuit devices (16, 16'). The apparatus includes an outer housing (18) enclosing therewithin an inner tip assembly (34). The inner tip assembly (34) is disposed for reciprocation through and past an orifice (24) formed in a fitting (26) closing one end of the casing (20) of the outer housing (18). The inner tip assembly (34) has formed therein a shoulder (76) which, when the assembly (34) is moved to an extended position, can engage a seat (78) formed in an inner surface of the fitting (26). An O-ring (80) can be interposed between the shoulder (76) and the seat (78) to preclude vacuum generated in vacuum chamber (30) from being directed other than through an orifice (68) formed in the inner tip assembly (34). An air cylinder (48) is provided to actuate the inner tip assembly (34) for movement between retracted and extended positions.

Abstract: The invention of the present document comprises apparatus for receiving and automatically feeding dual-in-line package (DIP) transportation and storage tubes (24) to the singulator (76) of an integrated circuit device handler (20) so that devices (22) in the tubes (24) can be introduced at the singulator (76). The tubes (24) are randomly placed in a hopper (66), and conveyed through an aperture (170) formed in a side wall (172) of the hopper (66). An elevator (74) is provided to raise the tubes (24) to a height at which open ends thereof are disposed above the height of the singulator (76). With a tube (24) so raised, a tube inserter (96) pushes the tube (24) into the tube holder (98) of a manipulator (100). The tube holder (98) is, in turn, pivoted to tilt the tube (24) so that devices (22) within the tube (24) are deposited for introduction into the singulator (76 ).

Abstract: The present invention is apparatus for automatically unloading integrated circuit devices passing from a test site or test sites of an integrated circuit handler down one or more chutes (64). The apparatus includes a stacker assembly (26) comprising one or more hoppers (34). Further, an accumulator assembly (28) providing a plurality of accumulating apertures (62) formed between various loom elements (58, 60) is provided. A shuttle (50) receives an integrated circuit storage and transfer tube (42) from one of the hoppers (34) and transfers the tube (42) to a position relative to the accumulator assembly (28) wherein it can be lifted off the shuttle (50) and maintained in a column of tubes (42) in an accumulating aperture (62).

Abstract: The present invention is a device for bringing integrated circuit devices (22), to be tested at a test site, to a temperature to which the devices (22) will be subjected during operating conditions of equipments in which they will ultimately be installed. The device includes a rack (30) comprising a plurality of rails (32) overlying corresponding tracks (24) down which the integrated circuits (22) move through a magazine (20). The rails (32) are adjustable toward and away from their corresponding tracks (24), and both are heated in order to impart thermal energy to integrated circuit devices (22) passing down the tracks (24). Each track (24) has, proximate a lower end thereof, a singulation assembly (56) which not only isolates a single device (22) to be passed to a test site, but also functions to press the lowermost device (22) in a string passing down the respective track (24) into close engagement with the track (24) in order to effect maximum heat transfer.