Abstract: A method of enhancing thermal management of an electronic device comprising the steps of; forming an ALOX™ interconnect substrate; taking an electronic device; and interconnecting the electronic device to the interconnect substrate to yield a substantial split of thermal and electrical paths in the interconnect substrate.

Abstract: A device (1,21,28, 36, 37, 86, 103, 121, 128) for electronic packaging, the device including a discrete solid body having a pair of opposing generally parallel major surfaces, the solid body having a body portion of a porous valve metal oxide based material with a pair of exterior surfaces respectively constituting portions of the major surfaces and extending inward from one major surface towards the other major surface, the body portion having one or more electrically insulated valve metal conductive traces of from about 10 &mgr;m to about 400 &mgr;m thickness in a direction from one major surface to the other major surface embedded therein, one or more of said traces having a trace portion divergingly extending inward from an exterior surface constituting a portion of one of said major surfaces.

Abstract: A substrate for electronic packaging, the substrate having a discrete, generally prismatoid, initially electrically conductive valve metal solid body with one or more spaced apart, original valve metal vias each individually electrically islolated by a porous oxidized body portion therearound. A pin jig fixture for mechanically masking a metal surface, the pin jig fixture having an anodization resistant bed of pins each pin having a leading end surface for intimate juxtaposition against a metal surface to mask portions thereof.