Patents Assigned to Micro Contact Solution Co, Ltd.
  • Patent number: 8167606
    Abstract: Disclosed herein is an apparatus and method for forming a panel. The apparatus includes a first mold unit may include a right-angled upper mold provided on the front portion of an upper mold to reciprocate vertically, and a right-angled lower mold provided on the front portion of a lower mold, thus compressing base materials to impart a pattern of a right triangular waveform. A second mold unit may include an obtuse upper mold provided on the central portion of the upper mold to reciprocate in a direction inclined relative to a progressing direction of the base materials, and an obtuse lower mold provided on the central portion of the lower mold, thus compressing the base materials to impart a pattern of an obtuse triangular waveform. A third mold unit may be provided behind the second mold unit and linearly presses the base materials in a direction from front to rear.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: May 1, 2012
    Assignee: Micro Contact Solution Co, Ltd.
    Inventor: Seung Eun Yang