Abstract: Provided is a semiconductor chip test socket configured to be coupled to a test circuit board for testing a semiconductor chip and provided with an integrated circuit (IC) chip having unique information and an algorithm for counting the number of times the semiconductor chip test socket is used, such that the number of times the semiconductor chip test socket is used may be exactly counted, and the IC chip may be easily installed and removed and securely protected from external impacts.

Abstract: An overload protection device for a compressor motor and, more specifically, to an overload protection device for a compressor motor, which has an overload protection means and can thus more effectively prevent overload of the compressor motor.

Abstract: Disclosed herein is an apparatus and method for forming a panel. The apparatus includes a first mold unit may include a right-angled upper mold provided on the front portion of an upper mold to reciprocate vertically, and a right-angled lower mold provided on the front portion of a lower mold, thus compressing base materials to impart a pattern of a right triangular waveform. A second mold unit may include an obtuse upper mold provided on the central portion of the upper mold to reciprocate in a direction inclined relative to a progressing direction of the base materials, and an obtuse lower mold provided on the central portion of the lower mold, thus compressing the base materials to impart a pattern of an obtuse triangular waveform. A third mold unit may be provided behind the second mold unit and linearly presses the base materials in a direction from front to rear.

Abstract: Disclosed herein is an apparatus and method for forming a panel. The apparatus includes a first mold unit may include a right-angled upper mold provided on the front portion of an upper mold to reciprocate vertically, and a right-angled lower mold provided on the front portion of a lower mold, thus compressing base materials to impart a pattern of a right triangular waveform. A second mold unit may include an obtuse upper mold provided on the central portion of the upper mold to reciprocate in a direction inclined relative to a progressing direction of the base materials, and an obtuse lower mold provided on the central portion of the lower mold, thus compressing the base materials to impart a pattern of an obtuse triangular waveform. A third mold unit may be provided behind the second mold unit and linearly presses the base materials in a direction from front to rear.