Abstract: A semiconductor burn-in oven includes a housing having a chamber, a heating device, testing circuitry having circuit connectors, and a seating assembly. The seating assembly includes a main frame, a main frame actuator connected to the main frame, a plurality of hook members connected to the main frame, and a hook driver. The main frame actuator is configured to drive movement of the main frame along a first axis between an extended position and a retracted position. The hook driver is configured to pivot each of the hook members about a pivot axis between a receiving position and a latching position. Board connectors of burn-in boards supported within the chamber are driven to seat with the circuit connectors when the burn-in boards are latched by the hook members in their latching position and the main frame is moved from the extended position to the retracted position.

Abstract: Provided is an apparatus/system for generating a nitrogen-enriched gas reliably and stably using a fuel cell. The nitrogen gas generation apparatus/system comprises: a fuel cell configured to operate by taking in air or a gas containing nitrogen and oxygen, and a fuel gas; and a catalyst combustion mechanism configured to cause an exhaust gas that is extracted from the fuel cell and has a lower oxygen concentration than air to react with the fuel gas on a combustion catalyst, and convert the exhaust gas having a lower oxygen concentration than air into a nitrogen-enriched gas having an increased nitrogen concentration.

Abstract: An apparatus/system for generating a high-purity nitrogen gas using a fuel cell includes; a fuel cell that operates by taking in air or a gas containing nitrogen and oxygen, and a fuel gas; a dehumidification mechanism that reduces moisture or water vapor content in an exhaust gas that is extracted from the fuel cell and has a lower oxygen concentration than air; and a filtering mechanism which includes a filter using fibers having different degrees of permeation for nitrogen and oxygen and converts the exhaust gas having a reduced moisture or water vapor content into a gas having an increased nitrogen concentration. The filter recovery ratio is higher when an oxygen concentration of a gas to be filtered is lower. The dehumidification mechanism is a pump unit including a water seal pump to provide an adiabatic expansion chamber in which the exhaust gas extracted from the fuel cell expands adiabatically.

Abstract: A semiconductor burn-in oven includes a housing including a burn-in chamber and an opening to the burn-in chamber surrounded by a front face, a heating device, testing circuitry, a door and a sealing mechanism. The door has an open position, in which the burn-in chamber is accessible through the opening, and a closed position, in which the door covers the opening. The sealing mechanism is configured to form a seal around the opening between an interior side of the door and the front face when the door is in the closed position. The sealing mechanism includes at least one sealing member having a recessed position, in which a gap extends between the front face and the interior side of the door, and a sealing position, in which the at least one sealing member closes the gap and forms the seal.

Abstract: An apparatus/system for generating a high-purity nitrogen gas using a fuel cell includes; a fuel cell that operates by taking in air or a gas containing nitrogen and oxygen, and a fuel gas; a dehumidification mechanism that reduces moisture or water vapor content in an exhaust gas that is extracted from the fuel cell and has a lower oxygen concentration than air; and a filtering mechanism which includes a filter using fibers having different degrees of permeation for nitrogen and oxygen and converts the exhaust gas having a reduced moisture or water vapor content into a gas having an increased nitrogen concentration. The filter recovery ratio is higher when an oxygen concentration of a gas to be filtered is lower. The dehumidification mechanism is a pump unit including a water seal pump to provide an adiabatic expansion chamber in which the exhaust gas extracted from the fuel cell expands adiabatically.

Abstract: An improved ultrasonic transducer for measuring stretch loads on bolts is provided. The improved ultrasonic transducer is separated into a pickup unit and a base sensor unit. The base sensor unit includes a piezo ceramic inside an aluminum can covered by a PCB for protection, which is surrounded by a strong magnet. Honey is used as a couplant between the base sensor unit and the bolt during operation. The base sensor unit stays on the bolt before and after tightening without changing the mechanical bonding between the sensor and bolt therefore achieving higher accuracy stretch readings. The base sensor unit is low cost and reusable, as it can be placed on number of bolts before tightening and can be removed after tightening, washed and then reused.

Abstract: A remote diode temperature sensing circuit for use in a burn-in system to sense a temperature of a semiconductor device under test includes a temperature sense circuit and an adapter circuit. The temperature sense circuit is configured to output temperature sense currents (Is) during a temperature sense routine. The adapter circuit is configured to drive mirrored sense currents (Ims), which mirror the temperature sense currents, through a diode of the semiconductor device that is connected to an input/output package pin, and present voltage differences across the diode responsive to the mirrored sense currents to the temperature sense circuit. The temperature sense circuit is configured to discharge a temperature output signal that is indicative of the temperature of the diode based on the voltage differences.

Abstract: A driving device for driving in rotation a toothed wheel, in particular a turntable, has a worm intended to mesh with the toothed wheel, a motor to drive the worm in rotation, a flexible sleeve that partially surrounds the worm in such a way as to form an assembly described as a worm/sleeve assembly, and a pre-stressing unit. The motor is arranged in a structure that is fitted pivotably relative to the worm/sleeve assembly, and the driving device also has a force transfer unit connecting the motor to the sleeve at a second extremity of the worm.

Abstract: A remote diode temperature sensing circuit for use in a burn-in system to sense a temperature of a semiconductor device under test includes a temperature sense circuit and an adapter circuit. The temperature sense circuit is configured to output temperature sense currents (Is) during a temperature sense routine. The adapter circuit is configured to drive mirrored sense currents (Ims), which mirror the temperature sense currents, through a diode of the semiconductor device that is connected to an input/output package pin, and present voltage differences across the diode responsive to the mirrored sense currents to the temperature sense circuit. The temperature sense circuit is configured to discharge a temperature output signal that is indicative of the temperature of the diode based on the voltage differences.

Abstract: Device for the translational guidance of a load and method for creating such a device. The guide device (1) comprises an elongate bed plate (2), a mobile carriage (6) which serves to support the load, and guide means (7) that allow the carriage (6) to move longitudinally in relation to the bed plate (2), said carriage (6) comprising a bottom plate (9) which is provided with through-cuts (10) intended to give it at least some lateral elasticity, and which is mounted on the bed plate (2) under lateral stress, as well as a platform (13) which is fixed to the top face of this bottom plate (9) at fixing points (14).

Abstract: A burn-in oven is provided with a plurality of spaced, stacked burn-in-boards, each with a plurality of individual circuits being tested under heated conditions, and a plurality of valve trays positioned between two burn-in-boards to form a heat exchange compartment below the valve tray. Each valve tray has a plenum formed above it to provide a separate chamber that is a source of cooling air. Each valve tray has a plurality of valves, one over each of a number openings in the tray. Each opening overlies an integrated circuits or device under test on the burn-in-board below the valve tray. The valves control the flow of air for cooling the integrated circuits. The flow of air through the valves is the only path for cooling airflow to the integrated circuits on the burn-in-boards.

Abstract: A burn-in system includes a testing stage configured to stress test one an integrated circuit and a power stage having a voltage control mode and a current control mode. The power stage is configured to supply power to the testing stage. One embodiment of the power stage includes a pulse width modulator, a current control circuit and a voltage control circuit. The pulse width modulator is configured to generate a modulated power output that is coupled to the testing stage. The current control circuit is configured to produce a current error output signal that is based on a difference between a measured load current, which is indicative of the current that is supplied to the testing stage by the modulated power output, and target load current.

Abstract: A burn-in system includes a testing stage configured to stress test one an integrated circuit and a power stage having a voltage control mode and a current control mode. The power stage is configured to supply power to the testing stage. One embodiment of the power stage includes a pulse width modulator, a current control circuit and a voltage control circuit. The pulse width modulator is configured to generate a modulated power output that is coupled to the testing stage. The current control circuit is configured to produce a current error output signal that is based on a difference between a measured load current, which is indicative of the current that is supplied to the testing stage by the modulated power output, and target load current.

Abstract: A burn-in oven is provided with a plurality of spaced, stacked burn-in-boards, each with a plurality of individual circuits being tested under heated conditions, and a plurality of valve trays positioned between two burn-in-boards to form a heat exchange compartment below the valve tray. Each valve tray has a plenum formed above it to provide a separate chamber that is a source of cooling air. Each valve tray has a plurality of valves, one over each of a number openings in the tray. Each opening overlies an integrated circuits or device under test on the burn-in-board below the valve tray. The valves control the flow of air for cooling the integrated circuits. The flow of air through the valves is the only path for cooling airflow to the integrated circuits on the burn-in-boards.

Abstract: A burn-in system includes single and dual power modes, a testing stage, first and second power stages, a single mode power control circuit and a dual mode power control circuit. When the burn-in system is in the single power mode, the first power stage produces a first power output to the testing stage based on a single mode error signal generated by the single mode power control circuit. When the burn-in system is in the dual power mode the first power stage produces the first power output and the second power stage produces a second power output in response to a dual mode error signal produced by the dual mode power control circuit. The first and second power outputs are coupled together when the burn-in system is in the dual power mode.

Abstract: A heat exchange system that can accommodate a high power integrated circuit chip for burn-in temperature stressing includes a heat sink having a chip engaging surface that is adapted to engage a surface of the chip. A liquid layer fills a heat exchange gap between the surface of the chip and the chip engaging surface of the heat sink. The liquid layer provides a low thermal resistance juncture between the chip engaging surface of the heat sink and the surface of the chip, which allows for greater heat transfer therebetween.

Abstract: A burn-in oven is provided with a plurality of spaced, stacked burn-in-boards, each with a plurality of individual circuits being tested under heated conditions, and a plurality of valve trays positioned between two burn-in-boards to form a heat exchange compartment below the valve tray. Each valve tray has a plenum formed above it to provide a separate chamber that is a source of cooling air. Each valve tray has a plurality of valves, one over each of a number openings in the tray. Each opening overlies an integrated circuits or device under test on the burn-in-board below the valve tray. The valves control the flow of air for cooling the integrated circuits. The flow of air through the valves is the only path for cooling airflow to the integrated circuits on the burn-in-boards.

Abstract: A burn-in oven is provided with a wall that has a number of vertically stacked, laterally extending slots aligned with each of the burn-in-board supports in the oven. When a burn-in-board is placed in the oven on the supports, an edge portion of the burn-in-board extends through a slot into a connector area. Each of the slots has a shutter associated therewith that will move from an open position to permit the burn-in-board connector portion to extend through the slot, to a closed position wherein the shutter covers the slot. A cam operator moves the shutters to a closed position, except when a burn-in-board is extending through a particular slot, it will support the shutter in its open position and the shutter will not be moved by the cam. All the shutters associated with openings through which no burn-in-board connector portion extends will be closed to prevent air flow from the burn-in oven.

Abstract: A burn-in oven is provided with a wall that has a number of vertically stacked, laterally extending slots aligned with each of the burn-in-board supports in the oven. When a burn-in-board is placed in the oven on the supports, an edge portion of the burn-in-board extends through a slot into a connector area. Each of the slots has a shutter associated therewith that will move from an open position to permit the burn-in-board connector portion to extend through the slot, to a closed position wherein the shutter covers the slot. A cam operator moves the shutters to a closed position, except when a burn-in-board is extending through a particular slot, it will support the shutter in its open position and the shutter will not be moved by the cam. All the shutters associated with openings through which no burn-in-board connector portion extends will be closed to prevent air flow from the burn-in oven.

Abstract: A chip temperature sensor includes a support member, a resistance temperature detector (RTD), and signal leads. The support member is slidably mountable within a heat sink bore of a burn-in oven heat exchange system and includes first and second ends, a socket formed in the first end, a bore extending from the socket through the second end, and a flange positioned between the first and second ends. The RTD is seated in the socket and includes a chip contact surface that is raised relative to the first end. The RTD is configured to produce a temperature signal that is indicative of a temperature at the chip contact surface. The signal leads are attached to the RTD and extend through the bore of the support member and out the second end of the support member. A heat exchange system that includes the above-described chip temperature sensor.