Abstract: There is provided with a method of mounting a circuit on a substrate which utilizes advantages of the COG method, can enhance the yield and can reduce the cost, and a circuit substrate for use in the method.A circuit pattern, including a pectinate connecting electrode having the same pitch interval as that of a pectinate marginal electrode on an electrode pattern formed on a substrate, is formed on a stick circuit substrate having the same coefficient of thermal expansion as that of the substrate and extending in the lateral or longitudinal direction of the margin of the substrate.After the necessary number of circuits are directly mounted on the circuit substrate, the pectinate marginal electrode of the substrate and the corresponding pectinate electrode of the circuit substrate are electrically connected.