Patents Assigned to Micro Mobio
  • Patent number: 7071783
    Abstract: An amplifier circuit for amplifying radio frequency signals having temperature compensation and bias compensation includes a radio frequency power amplifier that receives an input radio frequency signal and outputs an amplified radio frequency signal, and a first transistor performing as a detector diode with its collector and base connected. The base of the first transistor receives the amplified radio frequency signal from the power amplifier, a second DC bias input signal from a regulated DC source, and a third power-sensing signal. The amplifier circuit further includes a second transistor to amplify the DC component of the RF signal from the base of the first transistor. The base of the second transistor is coupled to the base of the first transistor. The collector of the second transistor outputs the power-sensing signal, which is coupled to the regulated DC source through a resistor.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: July 4, 2006
    Assignee: Micro Mobio Corporation
    Inventors: Ikuroh Ichitsubo, Weiping Wang
  • Patent number: 6977551
    Abstract: A power amplifier module for amplifying radio frequency signals includes first and second radio frequency power amplifiers with one or more semiconductor transistors, adapted to receive an input radio frequency signal and a processed power-sensing control signal and to output an amplified radio frequency signal; first and second power-sensing circuits each coupled to said first and second radio frequency power amplifiers and adapted to receive each amplified radio frequency signal and to output the power-sensing control signal; and control logic that receives and processes the power-sensing control signals, and outputs a processed power-sensing control signal in response to each quality or magnitude of each amplified radio frequency signal.
    Type: Grant
    Filed: February 24, 2005
    Date of Patent: December 20, 2005
    Assignee: Micro Mobio
    Inventors: Ikuroh Ichitsubo, Guan-Wu Wang, Weiping Wang
  • Patent number: 6928308
    Abstract: A mobile phone hand-free extension device includes a FM radio transmitter with an active frequency searching circuitry to utilize a vehicular FM radio receiver for reproducing the audio signals from the mobile phone. The active frequency searching circuitry in this invention automatically detects which frequency band the vehicular FM radio receiver is currently using and set the RF frequency of the FM transmitter to the detected frequency. The FM transmitter relays the audio signals from the mobile phone by transmitting the audio signals through radio wave to the vehicular FM radio receiver to be reproduced by the speaker of the receiver.
    Type: Grant
    Filed: June 8, 2002
    Date of Patent: August 9, 2005
    Assignee: Micro Mobio Corporation Taiwan Branch (USA)
    Inventors: Guan-Wu Wang, Yi-Jeng Yang, Wen-Chung Liu, Teng-Chi Lin
  • Patent number: 6914482
    Abstract: A power amplifier module for amplifying radio frequency signals includes a radio frequency power amplifier including one or more semiconductor transistors, adapted to receive an input radio frequency signal and power control signals, and to output an amplified radio frequency signal. The power amplifier module is integrated with input and output impedance matching networks and a power sensor that is adapted to receive the amplified radio frequency signal and to output a signal indicating the power output level of the power amplifier module. The power amplifier module also includes control logic in accordance to at least one of the qualities and the power level of the amplified radio frequency signal.
    Type: Grant
    Filed: May 10, 2004
    Date of Patent: July 5, 2005
    Assignee: Micro Mobio Corp.
    Inventors: Ikuroh Ichitsubo, Guan-Wu Wang, Weiping Wang
  • Patent number: 6847262
    Abstract: A power amplifier module for amplifying radio frequency signals includes first, second, third and fourth corner ground pads positioned at each corner of the power amplifier module; a radio frequency input pad positioned between the first and second corner ground pads; a radio frequency output pad positioned between the third and fourth corner ground pads; and a power amplifier circuit centrally positioned on the power amplifier module, the power amplifier having an input coupled to the radio frequency input pad and an output coupled to the radio frequency output pad.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: January 25, 2005
    Assignee: Micro Mobio Inc.
    Inventors: Ikuroh Ichitsubo, Guan-Wu Wang, Weiping Wang
  • Patent number: 6774718
    Abstract: A power amplifier module for amplifying radio frequency signals includes a radio frequency power amplifier including one or more semiconductor transistors, adapted to receive an input radio frequency signal and power control signals, and to output an amplified radio frequency signal. The power amplifier module is integrated with input and output impedance matching networks and a power sensor that is adapted to receive the amplified radio frequency signal and to output a signal indicating the power output level of the power amplifier module. The power amplifier module also includes control logic in accordance to at least one of the qualities and the power level of the amplified radio frequency signal.
    Type: Grant
    Filed: March 9, 2003
    Date of Patent: August 10, 2004
    Assignee: Micro Mobio Inc.
    Inventors: Ikuroh Ichitsubo, Guan-Wu Wang, Weiping Wang
  • Patent number: 6633005
    Abstract: An RF amplifier module includes PC boards laminated atop a bottom conductor plate. The boards include an RF semi-conductor amplifier chip mounted in a well extending to the bottom plate disposed in electrical connection with the chip.
    Type: Grant
    Filed: October 22, 2001
    Date of Patent: October 14, 2003
    Assignee: Micro Mobio Corporation
    Inventors: Ikuroh Ichitsubo, Guan-Wu Wang
  • Publication number: 20030076659
    Abstract: An RF amplifier module includes PC boards laminated atop a bottom conductor plate. The boards include an RF semi-conductor amplifier chip mounted in a well extending to the bottom plate disposed in electrical connection with the chip.
    Type: Application
    Filed: October 22, 2001
    Publication date: April 24, 2003
    Applicant: Micro Mobio Corporation
    Inventors: Ikuroh Ichitsubo, Guan-Wu Wang
  • Patent number: D497350
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: October 19, 2004
    Assignee: Micro Mobio Corp.
    Inventors: Ikuroh Ichitsubo, Guan-Wu Wang, Weiping Wang