Patents Assigned to Micro Power Systems
  • High temperature refractory metal contact assembly and multiple layer interconnect structure
    Patent number: 4152823
    Abstract: A multi-layer integrated semiconductor circuit interconnection structure with a first layer formed of a refractory metal sandwich including outer layers of silicon and a core of refractory metal providing a high temperature low ohmic contact assembly, an insulating layer formed on the first layer, and a patterned metal layer formed on the insulating layer to interconnect with the refractory layer and semiconductor device to provide an integrated circuit assembly.
    Type: Grant
    Filed: April 28, 1977
    Date of Patent: May 8, 1979
    Assignee: Micro Power Systems
    Inventor: John H. Hall