Abstract: The photosensitive resin composition of the present invention contains a vinyl-based (co)polymer (I) obtained by polymerizing a monomer mixture (?) containing a vinyl-based monomer (a) having a phenolic hydroxyl group, a vinyl-based copolymer (II) having a weight-average molecular weight of 15,000 to 120,000, obtained by polymerizing a monomer mixture (?) containing a vinyl-based monomer (b) represented by CH2?CR1COO(R2O)kR3 (wherein R1=a hydrogen atom or a methyl group, R2=a hydrocarbon group having a carbon number of 1 to 4, R3=a hydrogen atom or a methyl group, and k=1 to 90) and a carboxyl group-containing vinyl-based monomer (c), a photosensitive substance (III), and a compound (IV) which is a specific aromatic polyhydroxy compound.
Abstract: The photosensitive resin composition of the present invention contains a vinyl-based (co)polymer (I) obtained by polymerizing a monomer mixture (?) containing a vinyl-based monomer (a) having a phenolic hydroxyl group, a vinyl-based copolymer (II) having a weight-average molecular weight of 15,000 to 120,000, obtained by polymerizing a monomer mixture (?) containing a vinyl-based monomer (b) represented by CH2?CR1COO(R2O)kR3 (wherein R1=a hydrogen atom or a methyl group, R2=a hydrocarbon group having a carbon number of 1 to 4, R3=a hydrogen atom or a methyl group, and k=1 to 90) and a carboxyl group-containing vinyl-based monomer (c), a photosensitive substance (III), and a compound (IV) which is a specific aromatic polyhydroxy compound.
Abstract: A photosensitive resin composition comprising: a vinyl-based polymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group; a vinyl-based polymer (II) obtained by polymerizing a monomer mixture containing a carboxyl group-containing vinyl monomer (b), and having a weight average molecular weight of 20,000 to 100,000, provided that the vinyl-based polymer (I) is excluded; a quinonediazide compound (III); and a compound (IV) represented by following formula (5). [In the formula, Y is a hydrocarbon group of 1 to 6 carbon atoms; l and m are each independently an integer of 1 to 3; n is 1 or 2; p and q are each independently 0 or 1.].
Type:
Grant
Filed:
December 27, 2010
Date of Patent:
February 11, 2014
Assignees:
Micro Process Inc., Everlight Chemical Industrial Corporation, Mitsubishi Rayon Co., Ltd.
Inventors:
Akifumi Ueda, Hidetaka Nakagawara, Kazuo Watanabe, Shigeki Watanabe, Wei Jen Lan, Chao Wen Lin
Abstract: The present invention is related to a photosensitive resin composition containing: a vinyl-based copolymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group and a carboxyl group-containing vinyl monomer (b); a quinonediazide compound (II) and a compound (III) represented by the following formula (5), and to a photosensitive dry film and a method for forming a patter by using the photosensitive resin composition.
Type:
Grant
Filed:
December 27, 2010
Date of Patent:
February 11, 2014
Assignees:
Micro Process Inc, Everlight Chemical Industrial Corporation, Mitsubishi Rayon Co., Ltd.
Inventors:
Akifumi Ueda, Hidetaka Nakagawara, Kazuo Watanabe, Shigeki Watanabe, Wei Jen Lan, Chao Wen Lin
Abstract: A photosensitive resin composition comprising: a vinyl-based polymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group; a vinyl-based polymer (II) obtained by polymerizing a monomer mixture containing a carboxyl group-containing vinyl monomer (b), and having a weight average molecular weight of 20,000 to 100,000, provided that the vinyl-based polymer (I) is excluded; a quinonediazide compound (III); and a compound (IV) represented by following formula (5). [In the formula, Y is a hydrocarbon group of 1 to 6 carbon atoms; 1 and m are each independently an integer of 1 to 3; n is 1 or 2; p and q are each independently 0 or 1.
Type:
Application
Filed:
December 27, 2010
Publication date:
January 3, 2013
Applicants:
MICRO PROCESS INC., Mitsubishi Rayon Co., Ltd., EVERLIGHT CHEMICAL INDUSTRIAL CORPORATION
Abstract: The present invention is related to a photosensitive resin composition containing: a vinyl-based copolymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group and a carboxyl group-containing vinyl monomer (b); a quinonediazide compound (II) and a compound (III) represented by the following formula (5), and to a photosensitive dry film and a method for forming a patter by using the photosensitive resin composition.
Type:
Application
Filed:
December 27, 2010
Publication date:
November 29, 2012
Applicants:
MICRO PROCESS INC., Mitsubishi Rayon Co., Ltd., EVERLIGHT CHEMICAL INDUSTRIAL CORPORATION