Abstract: A system for separating semiconductor devices from a wafer having back metal exposed in scribe streets of the wafer positioned on a plastic film by applying a variable radial force to stretch and tension the film while controlling the stretch and tension as a function of a control parameter.

Abstract: A method of dividing a semiconductor wafer in which a sheet of deformable material engaging the metal layer side of the wafer has pressurized fluid applied thereto to cause the metal layer to break at the locations of wafer scribe streets.

Abstract: A method of dividing a semiconductor wafer having a metal layer and a semiconductor material layer including the step of cutting the semiconductor material layer along scribe streets without cutting the metal layer, turning over the wafer, and cutting the metal layer along the scribe streets.

Abstract: Apparatus and method for breaking a scribed semiconductor wafer utilizes two vacuum chucks, at least one of the vacuum chucks pivotable about a pivot line. The scribe line is aligned with the pivot line and relative movement between the vacuum chucks causes bending forces to be applied to the wafer and breakage of the wafer along the scribe line.

Abstract: When scribing a substrate, the precise location of the outer peripheral edge of the substrate on a stage is determined and movement of a scribe tool is controlled to first bring the scribe tool into engagement with the substrate at a location inwardly of the outer peripheral edge of the substrate. After a downwardly directed force of predetermined magnitude exerted by the scribe tool has been attained and stabilized, the scribe tool is moved along the substrate to form a scribe line.

Abstract: Particle removal structure is employed with a scribing tool to remove particles from the surface of a semiconductor wafer being scribed and transport the particles to another location.

Abstract: A scribing tool for use in semiconductor scribing apparatus includes a rotatable semiconductor wafer scribing wheel engageable with the semiconductor wafer to form a scribe line when the tool exerts pressure on the semiconductor wafer and the scribing wheel rotates. Bearings are engageable with the scribing wheel sides to resist sideways deflection during the scribing operation.

Abstract: A system for controlling scribing forces when scribing a semiconductor wafer includes supporting a scribe tool on an air bearing shaft. An encoder reads an encoder scale attached to the air bearing shaft and transport structure moves the tool support structure up or down to control the scribing force responsive to signals from the encoder.

Abstract: A method and apparatus for scribing a fixed, stationary semi-conductor wager wherein a multi-stage gantry is employed to move a scribe tool relative to the wafer. The force applied to the wafer by the scribe tool is controlled by an encoder detecting flexing of a scribe tool holder.

Abstract: An apparatus 100 for removing surface non-uniformities is provided. This apparatus has a stage 103 for holding a substrate 127 to be processed. This substrate often includes a film thereon, where the film has the non-uniformities. The apparatus 200 includes a movable head 111, which can provide rotatable movement about a fixed axis 123. A drive motor 115 is operably attached to the movable head 111 to provide this rotatable movement. A pad 113 (e.g., polishing or planarizing pad) is attached to the movable head. This pad 113 comprises an abrasive material and also has a smaller length (e.g, diameter, etc.) relative to a length (e.g, diameter, etc.) of the substrate. The smaller pad is capable of selectively removing a portion of the non-uniformities on the film.