Patents Assigned to Micro Relay Holdings Pty Ltd.
  • Electroplating pcb components
    Publication number: 20060175203
    Abstract: Curved out of plane metal components are formed on PCB substrates (11) by electroplating two layers (13, 14) of the same metal such that each layer has a different internal stress. This produces as curvature of the layer (13, 14) which enables coils, curved cantilever beams and springs to be fabricated. The amplitude and direction of curvature can be controlled by controlling the stress and thickness of each layer. The stress is controlled by controlling the composition of the electroplating bath.
    Type: Application
    Filed: March 8, 2004
    Publication date: August 10, 2006
    Applicant: Micro Relay Holdings Pty Ltd.
    Inventors: Timothy Davis, Breet Sexton